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74AXP1T34GS,125

NXP Semiconductors

74AXP1T34GS,125 by NXP Semiconductors

74AXP1T34GS,125 by NXP Semiconductors is a CMOS logic gate with 6 terminals and a supply voltage range of 0.7V to 2.75V. It has a propagation delay of 210ns, operates in industrial temperature range (-40°C to 85°C), and is designed for surface mount applications in small outline packages.

Median Price

$0.142

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 4,967 parts In-Stock

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$0.145

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$0.136

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DigiKey

USA . 4,967 parts In-Stock

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$0.140

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$0.140

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.116

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50

$0.116

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Digiode

USA . 1,885 parts In-Stock

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Vyrian

USA . 4,755 parts In-Stock

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VNN

France . 4,180 parts In-Stock

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Anansix

USA . 312 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

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$0.114

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$0.109

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Argo Parts USA

USA . 3,073 parts In-Stock

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$0.116

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Continental Prestige Electronics

USA . 1,294 parts In-Stock

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$0.116

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Corphita

USA . 2,314 parts In-Stock

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$0.130

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Microchip USA

USA . 7,647 parts In-Stock

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$0.183

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Ampacity Inc.

Singapore . 4,632 parts In-Stock

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$0.259

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QUARKTWIN TECHNOLOGY LTD

USA . 2,657 parts In-Stock

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UNI Independent Distributors

Spain . 2,551 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the 74AXP1T34GS,125 by NXP Semiconductors, a leading manufacturer in the industry. This Logic Gates product offers exceptional performance and versatility for a wide range of applications. With a compact design and advanced technology, this component ensures optimal functionality and efficiency. Experience seamless integration and enhanced functionality with the 74AXP1T34GS,125, delivering exceptional value and benefits to meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and reliability for the package.

Surface Mount: YES

Surface mount capability makes it easier to integrate the logic gate into electronic circuits.

Nominal Supply Voltage / Vsup (V): 1.2

The 1.2V supply voltage is a common standard in many electronic devices, making it compatible with a wide range of applications.

No. of Terminals: 6

The 6 terminals allow for versatile connectivity options in circuit design.

Propagation Delay (tpd): 210 ns

The low propagation delay of 210ns ensures fast and efficient operation of the logic gate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality even in extreme cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for logic gates.

Maximum Supply Voltage (Vsup): 2.75 V

The 2.75V maximum supply voltage allows for flexibility in power input options.

Technical Specifications

Logic Gates 74AXP1T34GS,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AXP

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

210 ns

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

.7 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

74AXP1T34GS,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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