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74AVCM162834DGG:11

NXP Semiconductors

74AVCM162834DGG:11 by NXP Semiconductors

NXP Semiconductors' 74AVCM162834DGG:11 is an 18-bit bus driver with a propagation delay of 2.5 ns, operating at a supply voltage of 1.8V. It features a small outline package and is suitable for industrial applications requiring true output polarity and dual terminal position control.

Median Price

$2.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.410

10k+ parts

-

380

-

-

$2.410

-

Rochester

USA . 380 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

380

-

$1.830

$1.640

$1.540

Verical

USA . 380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.050

10k+ parts

$1.925

380

-

-

$2.050

$1.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,450 parts In-Stock

1+ parts

$0.988

100+ parts

-

1k+ parts

-

10k+ parts

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1,450

$0.988

-

-

-

Vyrian

USA . 8,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,064

-

-

-

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Anansix

USA . 929 parts In-Stock

1+ parts

-

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929

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 144 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$0.880

-

-

-

Corphita

USA . 333 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$0.936

-

-

-

Microchip USA

USA . 434 parts In-Stock

1+ parts

$3.280

100+ parts

$3.280

1k+ parts

$3.280

10k+ parts

$3.280

434

$3.280

$3.280

$3.280

$3.280

Andel Nordic

Denmark . 1,594 parts In-Stock

1+ parts

$7.413

100+ parts

-

1k+ parts

$7.116

10k+ parts

$7.116

1,594

$7.413

-

$7.116

$7.116

Northwest PG Solutions

USA . 2,023 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,023

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-

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UNI Independent Distributors

Spain . 1,683 parts In-Stock

1+ parts

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100+ parts

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1,683

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-

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Continental Prestige Electronics

USA . 380 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

-

10k+ parts

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380

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$1.250

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Native Components

USA . 52 parts In-Stock

1+ parts

-

100+ parts

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52

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Overview

Discover the cutting-edge 74AVCM162834DGG:11 by NXP Semiconductors, a top-notch Bus Driver & Transceiver that delivers unparalleled performance and reliability. With a small outline package and a low propagation delay of 2.5ns, this innovative product is ideal for industrial applications requiring fast data transmission. Experience seamless connectivity and efficiency with NXP Semiconductors, trusted by industry professionals worldwide for superior quality and advanced technology. Upgrade your systems today and unlock endless possibilities with the 74AVCM162834DGG:11.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the transceiver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 2.5 ns

Low propagation delay ensures fast data transmission, making the bus driver efficient in handling communication between devices.

Surface Mount: YES

Surface mount capability allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V results in energy efficiency and lower power consumption, making the transceiver cost-effective in the long run.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and reliability of the bus driver.

Technical Specifications

Bus Driver & Transceivers 74AVCM162834DGG:11 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

AVC

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74AVCM162834DGG:11 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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