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NAU8223YG

Nuvoton Technology

NAU8223YG by Nuvoton Technology

CLASS D AUDIO AMPLIFIER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

Median Price

$0.890

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 1,850 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

$0.520

10k+ parts

-

1,850

$0.890

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$0.520

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

-

Kepictronics

USA . 490 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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490

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Perfect Parts

USA . 63 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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63

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Formix International (Excess)

India . 10 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10

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Technical Specifications

Audio & Video Amplifiers NAU8223YG attributes and parameters. Explore more Audio & Video Amplifiers devices from Nuvoton Technology

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3.1 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

NAU8223YG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Nuvoton Technology

Nuvoton Technology Corporation (Nuvoton) was founded to bring innovative semiconductor solutions to the market. Nuvoton was spun-off as a Winbond Electronics affiliate in July 2008 and went public in September 2010 on the Taiwan Stock Exchange (TWSE). Nuvoton focuses on the developments of microcontroller, microprocessor, smart home, cloud security, battery monitoring, component, visual sensing and IoT with security ICs and has strong market share in Industrial, Automotive, Communication, Consumer and Computer markets. Nuvoton owns 6-inch wafer fabs equipped with diversified processing technologies to provide professional wafer foundry services. Nuvoton provides products with a high performance/cost ratio for its customers by leveraging flexible technology, advanced design capability, and integration of digital and analog technologies. Nuvoton values long term relationships with its partners and customers and is dedicated to continuous innovation of its products, processes, and services. Nuvoton has established subsidiaries in the USA, China, Israel, India, Singapore, Korea and Japan to strengthen regional customer support and global management.

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