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UPB1007K

Nec Compound Semiconductor Devices

UPB1007K by Nec Compound Semiconductor Devices

DOWN CONVERTER; Maximum Noise Figure: 14.5 dB; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Minimum Down Conversion Gain: 15.5 dB; Characteristic Impedance: 50 ohm;

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Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

< 1k

Technical Specifications

RF/Microwave Up/Down Converters UPB1007K attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Nec Compound Semiconductor Devices

Specs

Additional Features:

HIGH RELIABILITY

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

15.5 dB

JESD-609 Code:

e0

LO Tunable:

YES

Maximum Noise Figure:

14.5 dB

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

RF or Microwave Device Type:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Nec Compound Semiconductor Devices

Tokyo, March 14, 2002 - NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) and Sumitomo Electric Industries, Ltd. (SEI) today announced they have joined into a multi-source agreement (MSA) to set a common architecture for 10 Gigabit per second (Gbps) detector modules used in optical networking. Sample shipments will start from today of products based on this common standard. The new device is developed to work within the 1.3 micron ~ 1.55 micron wavelength range and is mounted with a amplifier on the industry's smallest class of metal ceramic packages (L x W x H = 9.8mm x 7.5mm x 4.0mm). This super-small module addresses the calls coming from the industry for downsizing of 10 Gbps optical network transceivers. The detector module facilitates conversion of optical signals to electric signals and is one of the essential devices for 10 Gbps digital transmissions over optical fiber networks. NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) is a leading provider of opticaland microwave devices, committed to meeting the specialized needs of its customers in the broadband and mobile networking fields with its compound and silicon semiconductor technologies. NEC Compound Semiconductor Devices, was divided from NEC Corporation and established in October 2001.

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