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LBEE5PA1LD-TEMP

Murata Manufacturing

LBEE5PA1LD-TEMP by Murata Manufacturing

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 70; Package Code: XMA; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Other Function Telecom Interface ICs LBEE5PA1LD-TEMP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Murata Manufacturing

Specs

Additional Features:

Data rate-Max for 802.11bis 11Mbps; 802.11g is 54Mbps

Data Rate:

65 Mbps

JESD-30 Code:

R-XXMA-N70

Length:

8.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

70

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

250

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

10

Width:

7.8 mm

Trade Compliance

LBEE5PA1LD-TEMP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Murata Manufacturing

Murata Manufacturing Co., Ltd. is a Japanese electronics manufacturer founded in 1944 by Akira Murata. Through its expansive supply chain network and innovative product portfolio, Murata designs and manufactures a wide variety of electronic components including capacitors, inductor coils, buzzers, sensors and more for applications in the automotive, medical, industrial and consumer sectors. Based in Nagaokakyo City in Kyoto Prefecture of Japan, Murata operates factories around the world with other facilities located throughout Asia Pacific region such as China and Thailand; North America; Europe; Latin America; Middle East & Africa; as well as Oceania.

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Management team

Chairman of the Board

Tsuneo Murata

President

Norio Nakajima

Senior Executive VP, Board Member

Hiroshi Iwatsubo

Manufacturer fab locations 8

Fab name Location Fab Initiation Wafer Capacity

Murata Integrated Passive Solution

Fabrication

Fab Initiation

1989

France

Caen

Wafer Capacity

12,500

1989

12,500

Sendai Fab

Fabrication

Fab Initiation

2008

Japan

Sendai

Wafer Capacity

20,000

2008

20,000

Kanazawa - Fab 2

Fabrication

Fab Initiation

2016

Japan

Hakusan

Wafer Capacity

10,000

2016

10,000

Komoro

Fabrication

Fab Initiation

1980

Japan

Komoro

Wafer Capacity

1980

Yasu Plant

Fabrication

Fab Initiation

1987

Japan

Yasu

Wafer Capacity

14,500

1987

14,500

Kanazawa Plant

Fabrication

Fab Initiation

1985

Japan

Hakusan

Wafer Capacity

5,000

1985

5,000

Vantaa - Fab 1

Fabrication

Fab Initiation

1998

Finland

Vantaa

Wafer Capacity

5,000

1998

5,000

Vantaa - Fab 2

Fabrication

Fab Initiation

2006

Finland

Vantaa

Wafer Capacity

12,000

2006

12,000

Category top products 20

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