Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
334-90-142-00-010000 by Mill-max Mfg is a PLASTIC chip carrier IC socket for SIP42 devices with 42 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish and Tin/Lead (Sn/Pb) termination. Ideal for rectangular ICs, this socket offers reliable connectivity in electronic applications.
Median Price
$11.628
Lifecycle Status
Suppliers In-Stock
3
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1k+
Nova Conductors
1+ parts
100+ parts
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1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$6.537
Netroflash
$11.047
$10.814
Ampacity Inc.
$28.000
The use of plastic material makes the product lightweight and cost-effective.
Designed specifically for SIP42 devices, ensuring compatibility and a secure fit.
Having 42 contacts allows for a wide range of connections, making it versatile for various applications.
The tin lead finish over nickel provides reliable and durable mating connections.
The tin/lead termination with a nickel barrier ensures strong and consistent terminations for long-term use.
Being an IC socket type, this product allows for easy insertion and removal of integrated circuits.
The rectangular contact configuration offers a secure and stable connection between the socket and the device.
Chip Carrier IC & Component Sockets 334-90-142-00-010000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
334-90-142-00-010000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rectron
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148WS
Meritek Electronics
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
95.85.3SMA
Finder
Finder's 95.85.3SMA is a RELAY SOCKET with 8 contacts, rated at 10A current. It has a SNAP ON termination type and operates b/w -40°C to 70°C. Ideal for chip carrier IC & component sockets applications due to its straight mounting style and compact dimensions of 3.224" x 0.61" x 1.842".
315-47-102-41-003000
Mill-max Mfg
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): TIN; JESD-609 Code: e3; Contact Material: NOT SPECIFIED;
27E462
TE Connectivity
IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 22; Contact Material: NOT APPLICABLE; JESD-609 Code: e3; Contact Finish (Mating): NOT APPLICABLE;
XR2C-3215
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
PYFZ-08-E
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
416-43-226-41-006000
Mill-max Mfg's 416-43-226-41-006000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
8432-11B1-RK-TP
3m Electronic Products Division
8432-11B1-RK-TP by 3M is a PLCC32 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a temperature range of -40 to 105 °C and insulation resistance of 1G ohm. Ideal for chip carrier applications requiring solder termination in straight mounting style.
1437540-3
IC SOCKET; Device Type Used On: DIP32; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin/Lead (Sn/Pb); No. of Contacts: 32;
614-83-964-31-012101
Preci-dip Sa
614-83-964-31-012101 by Preci-dip Sa is a PCT POLYESTER Chip Carrier IC Socket with 64 BERYLLIUM COPPER contacts. It features GOLD (30) mating finish and Tin termination, suitable for DIP64 devices. Ideal for electronic applications requiring reliable connections in IC components.
PA1A-PS
Panasonic
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED;
P3G-08
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
8134-HC-8P2
Augat
IC SOCKET; Manufacturer Series: 8134-HC;
PY08
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
PT08-0
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-2821-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH;
2-2822979-3
TE Connectivity 2-2822979-3 is a POLYETHYLENE Chip Carrier IC Socket for LGA3647 devices. With 3647 contacts and 0.5A current rating, it operates b/w -25°C to 100°C. Ideal for surface mount applications in various electronic systems.
XR2A-4005
IC SOCKET; Manufacturer Series: XR2;
110-83-316-41-801101
110-83-316-41-801101 by Preci-dip Sa is a DIP16 IC socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and mating contact pitch of 0.1 inch, suitable for chip carrier applications. With solder termination and body dimensions of 0.799" length, 0.398" width, and 0.165" depth, it operates b/w -25°C to 85°C temperature range.
XR2A-2401-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
ICA-308-JGG
Samtec
Samtec's ICA-308-JGG is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features wire wrap termination, gold over nickel finish, and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring a mating pitch of 0.1 inch and dielectric voltage of 1400VAC.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
334-90-142-00-020000
IC SOCKET; Device Type Used On: SIP42; Housing Material: PLASTIC; Additional Features: SOCKET HEADER; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); Contact Config: RECTANGLE;
334-90-142-00-000
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 42; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL; Contact Config: RECTANGLE;
334-90-142-00-010
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; JESD-609 Code: e0; Contact Finish (Termination): TIN LEAD OVER NICKEL;
334-90-142-00-020
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SIP HEADER; Contact Finish (Termination): TIN LEAD OVER NICKEL; No. of Contacts: 42;
334-90-142-00-050
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Additional Features: SIP HEADER; No. of Contacts: 42;
334-90-142-00-100
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Contact Config: RECTANGLE; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL;
334-90-142-00-000000
IC SOCKET; Device Type Used On: SIP42; Housing Material: PLASTIC; Contact Config: RECTANGLE; Additional Features: SOCKET HEADER; JESD-609 Code: e0;
334-90-142-00-050000
IC SOCKET; Device Type Used On: SIP42; Housing Material: PLASTIC; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); JESD-609 Code: e0; Contact Material: NOT SPECIFIED;
334-90-142-00-100000
IC SOCKET; Device Type Used On: SIP42; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
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12,000 In-Stock
Total price ≈ $80,197.29
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