Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): TIN; JESD-609 Code: e3; Contact Material: NOT SPECIFIED;
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Advanced Electronics
Chip Carrier IC & Component Sockets 315-47-102-41-003000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Contact Finish - Termination:
IC Socket Type:
JESD-609 Code:
315-47-102-41-003000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Shenzhen Yixinsemi Electronics
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Weitronic Enterprise
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
XR2A-1605
Omron
IC SOCKET; Manufacturer Series: XR2;
XR3G-5211
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
264-4493-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 264-4493-00-0602J is a DIP64 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 64 gold (30) over nickel (50) contacts for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
8080-1G1-LF
TE Connectivity's 8080-1G1-LF is a PHENOLIC chip carrier socket for TO-3 devices. With 3 contacts, it supports up to 10A current and withstands 2121VAC. Ideal for applications requiring a STRAIGHT mounting style and RND PIN-SKT contact design in temperatures ranging from -55°C to 125°C.
134-10-328-00-000000
Mill-max Mfg
134-10-328-00-000000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
818-AG11D-ESL-LF
TE Connectivity's 818-AG11D-ESL-LF is a Chip Carrier IC Socket with 18 contacts, rated at 3A current. Featuring rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and operates b/w -55°C to 105°C. Ideal for DIP18 devices, this socket has a dielectric voltage of 1000VAC and insulation resistance of 5G ohm.
MT78740-
IC SOCKET; Housing Material: POLYAMIDE; No. of Contacts: 3; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Termination Type: SOLDER;
2-1419106-5
TE Connectivity 2-1419106-5 is a NYLON chip carrier socket with 11 RND PIN-SKT contacts. It is designed for use on RELAY devices, featuring SCREW termination type. Ideal for IC SOCKET applications.
XR2C-2001-N
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
2-821949-5
IC SOCKET; Device Type Used On: PQFP132; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: PHOSPHOR BRONZE; Additional Features: POLARIZED; Contact Finish (Mating): NOT SPECIFIED;
2-1571552-2
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
XR2A-2468
1415044-1
TE Connectivity's 1415044-1 is a Chip Carrier IC Socket with 11 contacts, rated for 10A current. It has a dielectric voltage of 2121VAC and operates b/w -40°C to 70°C. Ideal for use on relays due to its blade pin-skt contact style and solder termination.
SH2B-05C
Idec
SH2B-05C by Idec is a chip carrier IC socket with 2 contacts, rated for 10A current. It features screw termination and is designed for use on relay devices. With a body size of 2.716" x 1.181" x 1.161", this straight mounting style socket is ideal for relay applications.
XR2C-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2;
134-10-328-00-100000
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
415-43-236-41-001000
Mill-max Mfg's 415-43-236-41-001000 is a POLYETHYLENE chip carrier socket for SIP36 devices with 36 TIN contacts. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration and reliable termination finish.
214-44-314-01-670799
214-44-314-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket with 14 contacts, TIN finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for electronic applications requiring reliable and durable connections in integrated circuits.
6-1415034-1
IC SOCKET; No. of Contacts: 2; Additional Features: STANDARDS: CUL; VDE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2B-1601-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
315-43-103-41-001000
IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; Contact Finish (Termination): TIN; Additional Features: SIP SOCKET; Contact Config: RECTANGLE;
315-43-120-41-003000
IC SOCKET; Device Type Used On: SIP20; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; JESD-609 Code: e3; Contact Config: RECTANGLE;
Supply Digital Components
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$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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