Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Package Body Material: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE;
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Other Function Interface ICs PM8534B-FEI attributes and parameters. Explore more Other Function Interface ICs devices from Microsemi
Interface IC Type:
JESD-30 Code:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Surface Mount:
Temperature Grade:
Terminal Form:
Terminal Position:
PM8534B-FEI Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - PM85YYY 03/May/2019
PCN Packaging - Label and Packing 01/Oct/2018
Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F401CDY6TR
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
Yangzhou Yangjie Electronics
Sangdest Microelectronics (Nanjing)
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
Nexperia
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
SPC TECHNOLOGY/ MULTICOMP
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
MAX7301AAI+T
Analog Devices
MAX7301AAI+T by Analog Devices is a CMOS interface IC with 28 terminals. It operates b/w -40 to 125 °C, with supply voltage range of 2.5V to 5.5V. This small outline package is ideal for automotive applications requiring precise control and communication functions.
PCA9306DCTT
Texas Instruments
PCA9306DCTT by Texas Instruments is a dual-function interface IC with open-drain output. It operates b/w -40 to 85°C, with supply voltage ranging from 0 to 5.5V. Ideal for industrial applications requiring level shifting and voltage translation in a compact, surface-mount package.
ISO7240CDW
ISO7240CDW by Texas Instruments is a digital isolator with 4 channels, CMOS technology, and 3.3V nominal voltage. It operates in automotive-grade temperatures (-40 to 125°C) and has a small outline package style for surface mount applications. The IC features dual terminal position with nickel palladium gold finish, making it suitable for various interface functions in electronic systems.
MAX14933ASE+
Maxim Integrated
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP16,.24;
TXB0104DR
TXB0104DR by Texas Instruments is a 4-bit interface IC with 3-STATE output, operating at -40 to 85°C. It features a max supply voltage of 5.5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring true output polarity control in compact designs.
ISO7221BDR
ISO7221BDR by Texas Instruments is a 2-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V, it comes in a small outline package with dual terminals and nickel palladium gold finish.
TXB0108DQSR
TXB0108DQSR by Texas Instruments is an 8-bit interface IC with a max supply voltage of 3.6V and operating temperature range of -40 to 85°C. It features a small outline package style, surface mount capability, and 3-state output characteristics. Ideal for industrial applications requiring reliable signal interfacing in compact designs.
ISO7220CDR
ISO7220CDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 2.8V to 5V and compact dimensions of 4.905mm x 3.895mm, it offers high reliability in surface-mount designs.
PCA9306DCTR
PCA9306DCTR by Texas Instruments is a 2-function interface IC with max supply voltage of 5.5V and min of 1.8V. It operates in industrial temperature range, has 3-state output characteristics, and is ideal for applications requiring true output polarity control in a small outline package.
ISO7762DWR
ISO7762DWR by Texas Instruments is a small outline interface IC with 6 functions and 16 terminals. It operates at temperatures ranging from -55 to 125 °C and has a max supply voltage of 5.5 V. It is commonly used in military applications due to its CMOS technology and gull wing terminal form.
MAX31911AUI+T
Digital I/P Module; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;
SI8642ED-B-IS
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
ISO7721D
ISO7721D by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125 °C and supports supply voltage from 2.25V to 5.5V. With a small outline package style, it's ideal for military-grade applications requiring CMOS technology and Gull Wing terminal form.
SI8641BD-B-IS2
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP16,.4;
ISO7721FDW
ISO7721FDW by Texas Instruments is a dual-function interface IC with 2 channels, operating at -55 to 125°C. It features a small outline package style, Gull Wing terminal form, and CMOS technology. Ideal for military-grade applications requiring a supply voltage range of 2.25-5.5V in surface-mount designs.
MAX14850ASE+
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
6ES7131-6BH01-0BA0
Siemens
Digital I/P Module;
MAX13035EETE+T
MAX13035EETE+T by Analog Devices is a 16-terminal interface IC with BICMOS technology. It operates b/w -40 to 85 °C, with supply voltages of 1.62-3.6 V. Ideal for industrial applications requiring a compact chip carrier package style and matte tin terminal finish.
PCA9617ADPJ
PCA9617ADPJ by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 0.8V to 5.5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40°C to 85°C.
MAX14850AEE+
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
PM8531B-F3EI
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Terminal Position: UNSPECIFIED;
PM8533B-F3EI
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; No. of Functions: 1; Package Style (Meter): SPECIAL SHAPE;
PM8532B-F3EI
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Package Body Material: UNSPECIFIED;
PM8561B-F3EI
Microchip Technology
INTERFACE CIRCUIT; Package Shape: SQUARE; No. of Functions: 1; Package Body Material: UNSPECIFIED;
PM8536B-FEI
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; No. of Functions: 1;
PM8564B-FEI
INTERFACE CIRCUIT; Package Shape: SQUARE; Package Body Material: UNSPECIFIED; No. of Functions: 1;
PM8565B-FEI
PM8535B-FEI
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Minimum Operating Temperature: 0 Cel;
PM8563B-F3EI
PM8562B-F3EI
INTERFACE CIRCUIT; Package Shape: SQUARE; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
PM8566B-FEI
PM8573B-F3EI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Surface Mount: NO;
PM8572B-F3EI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Surface Mount: NO; Maximum Operating Temperature: 105 Cel;
PM8575B-FEI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Package Style (Meter): SPECIAL SHAPE;
PM8574B-FEI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Minimum Operating Temperature: -40 Cel;
PM8576B-FEI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Package Body Material: UNSPECIFIED; No. of Functions: 1;
PM8571B-F3EI
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel;
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