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APA300-FGG256ES

Microsemi

APA300-FGG256ES by Microsemi

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 274 parts In-Stock

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274

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Digiode

USA . 223 parts In-Stock

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223

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Distributors (Availability)

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Semicontronic

India . 815 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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815

$6.000

$5.850

$5.820

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Fulton Briggs Corp.

USA . 1,988 parts In-Stock

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Corphita

USA . 412 parts In-Stock

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412

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Technical Specifications

Field Programmable Gate Arrays (FPGA) APA300-FGG256ES attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of Logic Cells:

8192

No. of Inputs:

186

No. of Outputs:

186

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Qualified:

No

Trade Compliance

APA300-FGG256ES Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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