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KSZ8041NL

Microchip Technology

KSZ8041NL by Microchip Technology

Microchip's KSZ8041NL is a 32-terminal Ethernet transceiver with 100 Mbps data rate. Operating at 0-70°C, it has a 3.3V supply voltage and CMOS technology. Ideal for network interfaces, this chip carrier package is surface mountable and TS16949 compliant.

Median Price

$2.756

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Microchip Technology

USA . 9,115 parts In-Stock

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$2.040

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$1.530

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$1.430

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$1.370

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$2.040

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Verical

USA . 19 parts In-Stock

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Nova Conductors

Japan . 20 parts In-Stock

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TME

Poland . 7 parts In-Stock

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Chip Stock

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Vyrian

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Greenchips

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SIE Connect GmbH - GreenChips

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Sunrise Surplus Inc.

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Avant Electronics Limited

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Zilex Electronics Inc.

Canada . 200 parts In-Stock

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Speed Components Ltd

Israel . 122 parts In-Stock

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Tectiva GmbH

Germany . 90 parts In-Stock

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Cyclops Electronics Ltd

UK . 70 parts In-Stock

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Prism Electronics

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ComSIT Distribution GmbH

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LWI Electronics Inc

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Distributors (Availability)

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Argo Parts USA

USA . 2,894 parts In-Stock

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$1.479

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Continental Prestige Electronics

USA . 1,986 parts In-Stock

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$1.479

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$1.449

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Ampacity Inc.

Singapore . 10,153 parts In-Stock

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$1.730

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Semicontronic

India . 9,918 parts In-Stock

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$1.687

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$1.678

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Corohmni

South Africa . 847 parts In-Stock

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Aztec Data Supply Inc.

USA . 831 parts In-Stock

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RC Electronics

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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S.R.D Solutions

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Fulton Briggs Corp.

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Authorized Procurement Solutions

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Netroflash

USA . 100 parts In-Stock

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Overview

Enhance your network performance with the Microchip Technology KSZ8041NL Ethernet Transceiver. Designed with top-quality materials and cutting-edge technology, this network interface offers unparalleled reliability and efficiency. Whether you're looking to improve your home office setup or upgrade your business network, the KSZ8041NL is the perfect solution. Enjoy seamless connectivity, fast data rates of 100 Mbps, and a compact design that fits seamlessly into any system. Trust Microchip Technology to deliver the highest standards in networking technology. Elevate your networking experience with the KSZ8041NL today!

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: TS 16949

TS 16949 certification ensures high quality standards in manufacturing and testing processes, guaranteeing reliable and consistent performance.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board and allows for a compact design.

No. of Terminals: 32

Having a sufficient number of terminals enables connectivity and communication with other components in the network interface system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in thermal management and space-saving, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stability and reliability even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions, ensuring flexibility in usage scenarios.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, enhancing the durability and longevity of the product.

Terminal Position: QUAD

The quad terminal position allows for easy connection and integration with other components in the system, facilitating smooth operation and communication.

Maximum Seated Height: 0.9 mm

The low maximum seated height offers a slim profile, making it suitable for applications where space is limited.

Width: 5 mm

The compact width dimension allows for space-efficient placement on the circuit board, enabling a more streamlined and organized layout.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing damage to the component during soldering processes, ensuring reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes, ensuring secure and durable connections.

Length: 5 mm

The compact length dimension contributes to a space-efficient design, enabling easy integration into various electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard commercial operating conditions, making it a versatile choice for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption and high reliability, making the network interface energy-efficient and dependable in operation.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and complies with RoHS regulations, making it an eco-friendly choice.

Telecom IC Type: ETHERNET TRANSCEIVER

The Ethernet transceiver type enables high-speed data transmission and communication over Ethernet networks, ensuring efficient and reliable connectivity.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage is common in many electronic systems, ensuring compatibility and ease of integration with existing components.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and compact design, enabling the network interface to be used in space-constrained applications.

Data Rate: 100 Mbps

The 100 Mbps data rate provides fast and reliable data transmission speeds, making it suitable for applications requiring high bandwidth and performance.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate moisture sensitivity, allowing for safe storage and handling in typical manufacturing and operating environments.

Technical Specifications

Network Interfaces KSZ8041NL attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

KSZ8041NL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8517.70.00.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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