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ZL50233QCG1

Microchip Technology

ZL50233QCG1 by Microchip Technology

ZL50233QCG1 by Microchip: Telecom IC for ISDN echo cancellation. Features 100 terminals, 1.8-3.3V power supplies, and operates b/w -40 to 85°C. Ideal for digital transmission interfaces in industrial settings.

Median Price

$42.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 810 parts In-Stock

1+ parts

$42.070

100+ parts

$34.650

1k+ parts

$32.010

10k+ parts

$30.370

810

$42.070

$34.650

$32.010

$30.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Electronics Depot

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Bristol Electronics

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Atlantic Semiconductor

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Dan-Mar Components

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

RGB Technical Solutions

Ukraine . 2,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,917

-

-

-

-

Overview

Enhance your digital transmission interfaces with the ZL50233QCG1 by Microchip Technology. Known for their top-notch quality and innovative technology, Microchip Technology delivers reliable solutions for various applications in the telecom industry. This advanced ISDN echo canceller boasts a range of benefits, from its compact design to its industrial-grade temperature range. Experience seamless communication and improved performance with the ZL50233QCG1, designed to meet your every need. Elevate your connectivity with Microchip Technology's cutting-edge telecom ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and space-efficient PCB assembly, making the product suitable for compact designs.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages provides flexibility in system integration and compatibility with different power sources.

No. of Terminals: 100

Having a high number of terminals allows for connecting a variety of signals, enabling versatile functionality in the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style helps in achieving a compact form factor and efficient signal routing on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the product.

Telecom IC Type: ISDN ECHO CANCELLER

Being an ISDN echo canceller, the product provides clear and interference-free communication on ISDN lines, ensuring superior audio quality.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V contributes to energy efficiency and prolongs battery life in portable devices using the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting of components on the PCB, making the product suitable for space-constrained designs.

Technical Specifications

Digital Transmission Interfaces ZL50233QCG1 attributes and parameters. Explore more Digital Transmission Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

ZL50233QCG1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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