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WFI32E01UE-I

Microchip Technology

WFI32E01UE-I by Microchip Technology

The Microchip Technology WFI32E01UE-I is a telecom IC with 54 terminals, operating temperature range of -40 to 85°C, and supply voltage of 3.3V. It is designed for industrial applications requiring a surface-mount rectangular package style with a terminal pitch of 1.27mm.

Median Price

$10.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 440 parts In-Stock

1+ parts

$5.090

100+ parts

-

1k+ parts

-

10k+ parts

-

440

$5.090

-

-

-

DigiKey

USA . 11 parts In-Stock

1+ parts

$9.600

100+ parts

$9.000

1k+ parts

-

10k+ parts

-

11

$9.600

$9.000

-

-

Mouser Electronics

USA . 367 parts In-Stock

1+ parts

$11.420

100+ parts

-

1k+ parts

$9.000

10k+ parts

-

367

$11.420

-

$9.000

-

RS (Exports)

UK . 2 parts In-Stock

1+ parts

-

100+ parts

$12.738

1k+ parts

-

10k+ parts

-

2

-

$12.738

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

West Coast Incorporated

USA . 2,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,170

-

-

-

-

Overview

Discover the cutting-edge WFI32E01UE-I by Microchip Technology, a high-quality Telecom Interface IC designed to elevate your projects to new heights. With a focus on reliability and performance, Microchip Technology ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications in the telecom sector, this innovative IC offers unparalleled value, benefits, and advantages to customers looking to enhance their systems. Upgrade your projects with the WFI32E01UE-I and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Package Shape: RECTANGULAR

Standard shape for compatibility with various electronic devices and systems.

No. of Terminals: 54

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

High-quality manufacturing style for reliable performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with elevated temperature requirements.

Minimum Operating Temperature: -40 °C

Operational in extreme low-temperature conditions as well.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications for optimized functionality.

Nominal Supply Voltage: 3.3 V

Compatible with common voltage standards for easy integration.

Technical Specifications

Other Function Telecom Interface ICs WFI32E01UE-I attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XQMA-N54

Length:

24.5 mm

No. of Functions:

1

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

QMA

Package Equivalence Code:

MODULE,54LEAD,.7

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

20.5 mm

Trade Compliance

WFI32E01UE-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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