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UMX9989SM

Microchip Technology

UMX9989SM by Microchip Technology

PIN DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 39 parts In-Stock

1+ parts

$11.015

100+ parts

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39

$11.015

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Semicontronic

India . 23,769 parts In-Stock

1+ parts

$11.990

100+ parts

$11.690

1k+ parts

$11.630

10k+ parts

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23,769

$11.990

$11.690

$11.630

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Ampacity Inc.

Singapore . 135 parts In-Stock

1+ parts

$11.990

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135

$11.990

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LOOK Integrated Logistics

Peru . 3,768 parts In-Stock

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3,768

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Montano Global Distributors

Canada . 3,484 parts In-Stock

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3,484

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LMD Electronica

Estonia . 2,890 parts In-Stock

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2,890

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Argo Parts USA

USA . 2,859 parts In-Stock

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2,859

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Continental Prestige Electronics

USA . 2,682 parts In-Stock

1+ parts

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2,682

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Microchip USA

USA . 1,190 parts In-Stock

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1,190

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NIA Electronics

USA . 56 parts In-Stock

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56

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Ledger Components

France . 56 parts In-Stock

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56

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Technical Specifications

PIN Diodes UMX9989SM attributes and parameters. Explore more PIN Diodes devices from Microchip Technology

Specs

Application:

LIMITER

Minimum Breakdown Voltage:

75 V

Case Connection:

ISOLATED

Config:

SINGLE

Maximum Diode Capacitance:

5 pF

Nominal Diode Capacitance:

1.2 pF

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1 V

Frequency Band:

MEDIUM FREQUENCY TO VERY HIGH FREQUENCY

JESD-30 Code:

O-LELF-R2

Maximum Non Repetitive Peak Forward Current:

2.5 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Maximum Repetitive Peak Reverse Voltage:

75 V

Reverse Test Voltage:

0 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Form:

Terminal Position:

END

Trade Compliance

UMX9989SM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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