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TN2504N8-G

Microchip Technology

TN2504N8-G by Microchip Technology

TN2504N8-G by Microchip Technology is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It has 4.5A IDM, 1.6W Power Dissipation, and operates b/w -55 to 150 °C. This SMALL OUTLINE transistor features METAL-OXIDE SEMICONDUCTOR tech and offers fast switching with ton of 20ns and toff of 38ns.

Median Price

$1.148

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.278

100+ parts

-

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1

$0.278

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Mouser Electronics

USA . 1,625 parts In-Stock

1+ parts

$1.380

100+ parts

$1.050

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-

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1,625

$1.380

$1.050

-

-

DigiKey

USA . 10,059 parts In-Stock

1+ parts

-

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$1.050

10,059

-

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$1.050

Verical

USA . 1,500 parts In-Stock

1+ parts

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$1.247

10k+ parts

$1.109

1,500

-

-

$1.247

$1.109

Distributors (In-Stock)

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Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$0.998

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64

$0.998

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Vyrian

USA . 4,210 parts In-Stock

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4,210

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Electro Sonic

Canada . 2,000 parts In-Stock

1+ parts

-

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$1.050

10k+ parts

$1.030

2,000

-

-

$1.050

$1.030

IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.358

10k+ parts

$0.827

2,000

-

-

$1.358

$0.827

Bristol Electronics

USA . 100 parts In-Stock

1+ parts

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100

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Atlantic Semiconductor

USA . 100 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,105 parts In-Stock

1+ parts

$0.720

100+ parts

$0.702

1k+ parts

$0.698

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-

4,105

$0.720

$0.702

$0.698

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.978

100+ parts

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1k+ parts

$0.939

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2,000

$0.978

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$0.939

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Continental Prestige Electronics

USA . 6,091 parts In-Stock

1+ parts

$0.992

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$0.972

6,091

$0.992

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$0.972

Argo Parts USA

USA . 3,276 parts In-Stock

1+ parts

$0.992

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3,276

$0.992

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Ampacity Inc.

Singapore . 4,068 parts In-Stock

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$1.560

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$1.560

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,122 parts In-Stock

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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QualityLine Systems

Poland . 2,424 parts In-Stock

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2,424

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Kepictronics

USA . 1,076 parts In-Stock

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1,076

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Marpe Global Electronics

Taiwan . 769 parts In-Stock

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769

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XL Components Corporation

Australia . 105 parts In-Stock

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Perfect Parts

USA . 95 parts In-Stock

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Overview

Experience the next level of power efficiency and reliability with the TN2504N8-G by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-notch quality and performance in every product. This Power Field Effect Transistor (FET) is perfect for switching applications, offering enhanced mode operation and a built-in diode for added convenience. With a maximum pulsing drain current of 4.5 A and a minimum DS breakdown voltage of 40 V, this transistor provides unmatched power dissipation and operational temperature range. Trust Microchip Technology to provide you with the best solution for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the FET, making it a reliable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and allows for better efficiency in switching applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle higher voltages without risk of damage, ensuring long-term reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control and modulation of the transistor's characteristics, enhancing its overall performance.

Maximum Power Dissipation (Abs): 1.6 W

The high maximum power dissipation of 1.6 W enables the FET to handle high power levels without overheating, increasing its reliability in demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand higher temperatures, making it suitable for a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good solderability and ensures secure connections, improving the overall reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) TN2504N8-G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

.89 A

Maximum Drain-Source On Resistance:

1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-243AA

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4.5 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

38 ns

Maximum Turn On Time (ton):

20 ns

Trade Compliance

TN2504N8-G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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