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SY89874UMG-TR

Microchip Technology

SY89874UMG-TR by Microchip Technology

SY89874UMG-TR by Microchip: Clock driver with 16 terminals, 0.79ns propagation delay, and 4 true outputs. Ideal for industrial applications requiring differential mux input conditioning at temperatures ranging from -40 to 85°C. Package style is chip carrier with a very thin profile, suitable for surface mount assembly.

Median Price

$10.400

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 989 parts In-Stock

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$10.400

100+ parts

$7.890

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$7.890

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989

$10.400

$7.890

$7.890

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Distributors (In-Stock)

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Semi Source

USA . 578 parts In-Stock

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578

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Sea View Technologies

USA . 569 parts In-Stock

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569

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IBS Electronics

USA . 51 parts In-Stock

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$12.507

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$12.041

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51

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Inventory MP

USA . 24 parts In-Stock

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Bristol Electronics

USA . 24 parts In-Stock

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24

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Distributors (Availability)

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Component Stockers USA

USA . 17,844 parts In-Stock

1+ parts

$5.440

100+ parts

$5.440

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$5.440

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17,844

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$5.440

$5.440

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West Coast Incorporated

USA . 7,708 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Lixinc

USA . 2,827 parts In-Stock

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GreenTree Electronics

Israel . 850 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 446 parts In-Stock

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Kepictronics

USA . 432 parts In-Stock

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A-Z Elektronik GmbH

Germany . 161 parts In-Stock

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Overview

Unlock the potential of your next project with the SY89874UMG-TR clock driver by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers unparalleled quality and reliability. Ideal for clock distribution applications, this surface mount device offers differential mux input conditioning, ensuring optimal performance. With a low propagation delay and wide operating temperature range, this product provides exceptional value and benefits to customers. Trust Microchip Technology to elevate your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easy and convenient installation on PCBs, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is a common and widely available power source, making this product compatible with many existing systems and applications.

Propagation Delay (tpd): 0.79 ns

With a low propagation delay of 0.79 ns, this clock driver & buffer ensures fast and efficient signal transmission, ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in a wide range of environmental conditions, enhancing the product's durability and longevity.

Width: 3 mm

With a compact width of 3mm, this product is space-efficient and can be easily integrated into tight PCB layouts.

Minimum Supply Voltage (Vsup): 2.375 V

The low minimum supply voltage requirement of 2.375V enables operation in low-power scenarios, making it energy-efficient and versatile.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this clock driver & buffer meets strict performance standards and reliability requirements for industrial applications.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this product can withstand moderate exposure to moisture during storage and handling, ensuring product integrity and reliability.

Technical Specifications

Clock Drivers & Buffers SY89874UMG-TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

CAN ALSO OPERATE WITH 3.3V SUPPLY

Family:

89874

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.79 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Minimum fmax:

2500 MHz

Trade Compliance

SY89874UMG-TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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