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SY75608TWL-TR

Microchip Technology

SY75608TWL-TR by Microchip Technology

SY75608TWL-TR clock driver by Microchip Technology features a propagation delay of 1.5 ns, operating temperature range from -40 to 105 °C, and 16 true outputs at a max frequency of 250 MHz. This chip carrier with very thin profile is ideal for applications requiring differential mux input conditioning in surface mount configurations.

Median Price

$2.560

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 66,000 parts In-Stock

1+ parts

$2.560

100+ parts

$1.940

1k+ parts

$1.880

10k+ parts

$1.850

66,000

$2.560

$1.940

$1.880

$1.850

DigiKey

USA . 4,898 parts In-Stock

1+ parts

$2.560

100+ parts

$2.063

1k+ parts

-

10k+ parts

$2.063

4,898

$2.560

$2.063

-

$2.063

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NIA Electronics

USA . 5,296 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,296

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-

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Ledger Components

France . 5,296 parts In-Stock

1+ parts

-

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-

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5,296

-

-

-

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LMD Electronica

Estonia . 3,117 parts In-Stock

1+ parts

-

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3,117

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Montano Global Distributors

Canada . 1,141 parts In-Stock

1+ parts

-

100+ parts

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1,141

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LOOK Integrated Logistics

Peru . 81 parts In-Stock

1+ parts

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81

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Overview

Unlock the power of precision timing with the SY75608TWL-TR clock driver by Microchip Technology. Designed with quality and reliability in mind, this product offers customers a seamless experience with its differential mux input conditioning and 3-state output characteristics. Ideal for a wide range of applications, this clock driver provides a propagation delay of just 1.5 ns, ensuring optimal performance in high-speed environments. Trust in Microchip Technology to deliver cutting-edge solutions that bring value and efficiency to your projects. Elevate your designs with the SY75608TWL-TR clock driver today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the components inside, making this product a reliable choice.

Propagation Delay At Nominal Supply: 1.5 ns

With a low propagation delay, this clock driver & buffer can efficiently process signals at a fast rate, ensuring accurate timing in electronic systems.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on a PCB, saving space and improving overall design flexibility.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning helps in reducing noise and improving signal integrity, leading to reliable data transmission.

Nominal Supply Voltage / Vsup (V): 1.8

The 1.8V supply voltage is common in many electronic systems, making this clock driver & buffer compatible with a wide range of applications.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options and supports complex circuit configurations, enhancing the functionality of the product.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 to 105°C) ensures reliable performance in various environmental conditions, making this product suitable for different applications.

Maximum Power Supply Current (ICC): 35 mA

With a low power supply current requirement, this clock driver & buffer helps in reducing power consumption and heat generation in electronic devices.

Technical Specifications

Clock Drivers & Buffers SY75608TWL-TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

Family:

SY756

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N48

Length:

6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay At Nominal Supply:

1.5 ns

Propagation Delay (tpd):

1.5 ns

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

1.98 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

250 MHz

Trade Compliance

SY75608TWL-TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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