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SY10EP51VMG-TR

Microchip Technology

SY10EP51VMG-TR by Microchip Technology

D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,000 parts In-Stock

1+ parts

$3.490

100+ parts

$2.650

1k+ parts

$2.560

10k+ parts

$2.530

7,000

$3.490

$2.650

$2.560

$2.530

DigiKey

USA . 2,152 parts In-Stock

1+ parts

$3.490

100+ parts

$3.442

1k+ parts

$2.813

10k+ parts

-

2,152

$3.490

$3.442

$2.813

-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$3.490

100+ parts

$2.810

1k+ parts

-

10k+ parts

-

30

$3.490

$2.810

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,000

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-

-

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Connector Distribution Corp

USA . 42 parts In-Stock

1+ parts

-

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42

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-

-

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Right Parts Inc.

USA . 42 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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42

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 203 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

10k+ parts

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203

$2.970

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,076

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-

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,000

-

-

-

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Fulton Briggs Corp.

USA . 5,347 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,347

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-

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Perfect Parts

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,034

-

-

-

-

Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,100

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

-

Technical Specifications

Latches & Flip-Flops SY10EP51VMG-TR attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.42 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

3000 MHz

Trade Compliance

SY10EP51VMG-TR Logic ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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