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PIC32MZ2048EFH100T-250I/GJX

Microchip Technology

PIC32MZ2048EFH100T-250I/GJX by Microchip Technology

PIC32MZ2048EFH100T-250I/GJX by Microchip: 32-bit RISC CPU, 64 MHz clock, 40-Ch ADC for industrial applications. Features 8 DMA channels, 10 timers, and CAN/USB connectivity. Low power mode with 135 mA max supply current ideal for IoT devices.

Median Price

$19.730

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$19.730

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Vyrian

USA . 10,688 parts In-Stock

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AZTECH Wire

Italy . 477 parts In-Stock

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$5.761

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Ampacity Inc.

Singapore . 682 parts In-Stock

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Continental Prestige Electronics

USA . 312 parts In-Stock

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$19.335

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Corohmni

South Africa . 429 parts In-Stock

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$63.037

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Aztec Data Supply Inc.

USA . 4,558 parts In-Stock

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$75.450

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Argo Parts USA

USA . 3,581 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,383 parts In-Stock

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QualityLine Systems

Poland . 1,383 parts In-Stock

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XL Components Corporation

Australia . 1,383 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the cutting-edge PIC32MZ2048EFH100T-250I/GJX microcontroller by Microchip Technology, a leading manufacturer in the industry. This powerful device offers unparalleled performance and reliability for a wide range of applications. With integrated cache, advanced peripherals, and low power modes, this microcontroller is perfect for industrial-grade projects that demand efficiency and precision. Elevate your designs with the exceptional quality and value of the PIC32MZ2048EFH100T-250I/GJX, setting new standards in microcontroller technology.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Integrated Cache : YES

The integrated cache helps in improving the processing speed and efficiency of the microcontroller, making it suitable for high-performance tasks.

Maximum Supply Voltage : 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages and power requirements.

Surface Mount : YES

Being surface mountable allows for easy integration onto circuit boards, saving space and reducing assembly time.

On Chip Data RAM Width : 8

An 8-bit data RAM width allows for efficient data processing and storage within the microcontroller.

Screening Level : TS 16949

This screening level indicates high reliability and quality standards, ensuring the microcontroller meets industry requirements.

No. of Terminals : 100

The large number of terminals enable connectivity to various components and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers PIC32MZ2048EFH100T-250I/GJX attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

78

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.06 mm

Speed:

252 rpm

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB

Peripherals:

BOR, COMPARATOR(2), DMA(8), POR, PWM, RTC, TIMER(10), WDT

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

PIC32MZ2048EFH100T-250I/GJX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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