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PIC32MZ1024EFG064T-I/PT

Microchip Technology

PIC32MZ1024EFG064T-I/PT by Microchip Technology

PIC32MZ1024EFG064T-I/PT by Microchip: 32-bit RISC CPU, 64 MHz clock, 24-Ch ADC for industrial applications. Features DMA with 12 channels, 9 timers, and peripherals like CAN, USB, and Ethernet connectivity. Ideal for low power mode operation in microcontroller projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,063 parts In-Stock

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Nova Conductors

Japan . 77 parts In-Stock

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Semicontronic

India . 229 parts In-Stock

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$10.000

100+ parts

$9.750

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$9.700

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229

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$9.700

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AZTECH Wire

Italy . 307 parts In-Stock

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$17.955

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Aztec Data Supply Inc.

USA . 3,140 parts In-Stock

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$32.120

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Corohmni

South Africa . 10 parts In-Stock

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LMD Electronica

Estonia . 7,017 parts In-Stock

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Montano Global Distributors

Canada . 5,615 parts In-Stock

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Continental Prestige Electronics

USA . 5,542 parts In-Stock

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Argo Parts USA

USA . 4,706 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,957 parts In-Stock

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NIA Electronics

USA . 1,342 parts In-Stock

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Ledger Components

France . 1,342 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of innovation with the PIC32MZ1024EFG064T-I/PT microcontroller from Microchip Technology. Designed with cutting-edge technology and high-quality materials, this versatile device offers a wide range of applications in various industries. With its advanced features, integrated cache, and low power mode, this microcontroller delivers unmatched value and performance for your projects. Experience seamless connectivity, enhanced processing speed, and reliable operation with the PIC32MZ1024EFG064T-I/PT - the perfect choice for your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for portable and rugged applications.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the microcontroller, making it suitable for high-performance tasks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can function reliably in various environmental conditions.

CPU Family: PIC32

Being part of the PIC32 CPU family ensures compatibility and support from a well-established brand in the microcontroller industry.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with a wide range of sensors and external components.

Peripheral IC Type: MICROCONTROLLER, RISC

With a RISC-based architecture, this microcontroller delivers efficient performance and power consumption, making it a suitable choice for embedded applications.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, making it suitable for battery-powered devices.

Connectivity: CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

The multiple connectivity options provided by this microcontroller enable seamless communication and integration with various types of devices and networks.

Technical Specifications

Microcontrollers PIC32MZ1024EFG064T-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

46

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Current:

130 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

PIC32MZ1024EFG064T-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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