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PIC32MZ1024EFG064-E/MR

Microchip Technology

PIC32MZ1024EFG064-E/MR by Microchip Technology

PIC32MZ1024EFG064-E/MR by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 524288 RAM bytes, and 1048576 ROM words. Ideal for automotive applications, it features CAN, Ethernet, I2C, SPI connectivity options and operates at temperatures ranging from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,901 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 332 parts In-Stock

1+ parts

$10.450

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332

$10.450

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Semicontronic

India . 70 parts In-Stock

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$10.450

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$10.189

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$10.136

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70

$10.450

$10.189

$10.136

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AZTECH Wire

Italy . 87 parts In-Stock

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$15.010

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87

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Corohmni

South Africa . 791 parts In-Stock

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$52.140

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791

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Aztec Data Supply Inc.

USA . 133 parts In-Stock

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$58.790

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133

$58.790

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XL Components Corporation

Australia . 8,146 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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QualityLine Systems

Poland . 6,732 parts In-Stock

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Continental Prestige Electronics

USA . 5,774 parts In-Stock

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Argo Parts USA

USA . 4,184 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,094 parts In-Stock

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Unleash the power of innovation with the PIC32MZ1024EFG064-E/MR by Microchip Technology. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With integrated cache, advanced peripherals, and low power mode, this product delivers exceptional performance while maximizing efficiency. Trust in Microchip Technology's legacy of excellence and elevate your projects to new heights with the PIC32MZ1024EFG064-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for electronic applications where weight is a concern.

Integrated Cache: YES

Having an integrated cache improves processing speed and overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

Support for higher supply voltage allows for flexibility in power supply design.

Package Shape: SQUARE

Square shape packages are space-efficient and easier to handle during assembly.

Bit Size: 32

32-bit architecture allows for handling of more complex operations and data compared to lower bit sizes.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the microcontroller suitable for diverse environmental conditions.

ROM Programmability: FLASH

Using flash ROM allows for easy and quick programmability without the need for external programming tools.

Connectivity: CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

The wide range of connectivity options enables integration with different devices and communication protocols.

Technical Specifications

Microcontrollers PIC32MZ1024EFG064-E/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

46

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.9 mm

Speed:

180 rpm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

PIC32MZ1024EFG064-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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