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PIC32MX575F256HT-80I/MR

Microchip Technology

PIC32MX575F256HT-80I/MR by Microchip Technology

PIC32MX575F256HT-80I/MR by Microchip: 32-bit RISC microcontroller with 262144 ROM words, 65536 RAM words, and 16-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 50 MHz, featuring low power mode and connectivity options like Ethernet, I2C(5), SPI(4), UART(6), USB.

Median Price

$11.114

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

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Vyrian

USA . 1,326 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 931 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

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931

$2.000

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$1.940

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AZTECH Wire

Italy . 800 parts In-Stock

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$10.068

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 372 parts In-Stock

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$10.892

372

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$10.892

Ampacity Inc.

Singapore . 184 parts In-Stock

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$12.000

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Aztec Data Supply Inc.

USA . 3,897 parts In-Stock

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$34.540

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3,897

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Corohmni

South Africa . 3 parts In-Stock

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$36.506

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$65.899

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$62.604

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$62.604

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Lixinc

USA . 17,283 parts In-Stock

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Fulton Briggs Corp.

USA . 8,337 parts In-Stock

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Argo Parts USA

USA . 2,276 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with Microchip Technology's PIC32MX575F256HT-80I/MR microcontroller! This top-of-the-line device offers unparalleled performance and reliability in a compact package. Perfect for a wide range of applications, this microcontroller boasts integrated cache, low power mode, and a plethora of peripherals such as Ethernet, USB, and SPI connectivity. Experience the future of microcontrollers with the PIC32MX575F256HT-80I/MR - where quality meets innovation to deliver exceptional value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

The integrated cache helps in boosting the performance by storing frequently accessed data closer to the CPU.

Maximum Clock Frequency: 50 MHz

The high clock frequency allows for faster processing speeds, making the microcontroller suitable for tasks that require quick responses.

ADC Channels: YES

The presence of Analog to Digital Convertors enables the microcontroller to read and process analog inputs, expanding its range of applications.

Connectivity: ETHERNET, I2C(5), SPI(4), UART(6), USB

The various connectivity options make this microcontroller versatile and suitable for a wide range of communication tasks.

Low Power Mode: YES

The low power mode helps in conserving energy and extending the battery life, making it ideal for portable devices.

Technical Specifications

Microcontrollers PIC32MX575F256HT-80I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

98 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(5), SPI(4), UART(6), USB

Peripherals:

BOR, COMPARATOR(2), DMA(8), POR, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

PIC32MX575F256HT-80I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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