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PIC32MX570F512L-I/PF

Microchip Technology

PIC32MX570F512L-I/PF by Microchip Technology

PIC32MX570F512L-I/PF by Microchip Technology is a 32-bit microcontroller with 16-bit address bus, 32-bit data RAM, and 131072 ROM words. It features 48-Ch 10-Bit ADCs, 4 DMA channels, and operates at a max frequency of 40 MHz. Ideal for industrial applications requiring low power consumption and extensive peripheral support like analog comparators, PWM, UART, SPI, and I2C connectivity.

Median Price

$8.590

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 269 parts In-Stock

1+ parts

$2.740

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$2.740

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RS Americas

USA . 269 parts In-Stock

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$5.470

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$5.470

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Mouser Electronics

USA . 137 parts In-Stock

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$8.590

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$7.130

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137

$8.590

$7.130

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DigiKey

USA . 88 parts In-Stock

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$8.590

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$7.130

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88

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Microchip Technology

USA . 75 parts In-Stock

1+ parts

$8.590

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$7.130

1k+ parts

$6.560

10k+ parts

$6.240

75

$8.590

$7.130

$6.560

$6.240

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$8.200

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10

$8.200

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Vyrian

USA . 177 parts In-Stock

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Lantek

USA . 25 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 607 parts In-Stock

1+ parts

$4.650

100+ parts

$4.534

1k+ parts

$4.510

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607

$4.650

$4.534

$4.510

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$7.966

100+ parts

$7.966

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$7.966

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100

$7.966

$7.966

$7.966

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$8.036

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$7.715

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$8.036

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Continental Prestige Electronics

USA . 6,128 parts In-Stock

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$8.200

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$8.036

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$8.036

Corohmni

South Africa . 733 parts In-Stock

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$27.391

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733

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Aztec Data Supply Inc.

USA . 253 parts In-Stock

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$63.440

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Lixinc

USA . 15,115 parts In-Stock

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West Coast Incorporated

USA . 6,048 parts In-Stock

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Argo Parts USA

USA . 3,267 parts In-Stock

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Allen Electronics Distributors

USA . 269 parts In-Stock

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$12.930

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$10.890

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$10.890

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Kepictronics

USA . 10 parts In-Stock

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Overview

Experience seamless performance and innovation with the PIC32MX570F512L-I/PF microcontroller by Microchip Technology. Designed to meet the highest standards of quality and reliability, this versatile device offers a wide range of applications in the field of microcontrollers. With its advanced features and cutting-edge technology, customers can expect exceptional value, efficiency, and precision in their projects. Unlock endless possibilities and elevate your designs with the PIC32MX570F512L-I/PF microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of operating voltage options.

On Chip Data RAM Width: 32

Efficient data processing capabilities with a 32-bit RAM width.

Address Bus Width: 16

Enables access to 64K memory space with a 16-bit address bus.

Package Shape: SQUARE

Square shape allows for easier integration and layout in circuit designs.

Bit Size: 32

Enhanced processing power with a 32-bit microcontroller.

No. of Terminals: 100

Provides flexibility for connecting various external components.

Package Style: FLATPACK, THIN PROFILE

Thin profile design saves space and allows for compact device applications.

Minimum Supply Voltage: 2.3 V

Offers lower power consumption options with a 2.3V minimum supply voltage.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with a high operating temperature range.

CPU Family: PIC32

Part of a reliable and established microcontroller family for seamless integration.

No. of External Interrupts: 5

Allows for efficient handling of external events and interrupts.

Minimum Operating Temperature: -40 °C

Can operate in harsh environments with a low operating temperature limit.

Terminal Finish: MATTE TIN

Provides a reliable and consistent terminal finish for long-term use.

ADC Channels: YES

Built-in Analog-to-Digital Converters for precise measurement and control.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connectivity.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

RAM Words: 16384

Sufficient RAM capacity for data storage and processing.

Width: 14 mm

Compact width for versatile placement in electronic devices.

Peripherals: ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Diverse peripherals for enhanced functionality and control options.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper solder reflow during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly.

Length: 14 mm

Compact length allows for easy integration in various devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions and temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing architecture for efficient processing.

No. of Timers: 7

Multiple timers for precise timing control and synchronization.

RAM Bytes: 65536

Large RAM capacity for data storage and processing needs.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and connection reliability.

Analog To Digital Convertors: 48-Ch 10-Bit

High-resolution ADCs for accurate analog signal conversion.

Nominal Supply Voltage: 3.3 V

Typical operating voltage for compatibility with standard components.

No. of DMA Channels: 4

Multiple DMA channels for efficient data transfer and processing.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals.

Connectivity: I2C(2), SPI(4), UART(5)

Multiple communication interfaces for versatile connectivity options.

ROM Programmability: FLASH

Flash ROM for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact and high-density circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 suitable for standard surface mount assembly processes.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute for precise timing applications.

Low Power Mode: YES

Supports low power operation for energy-efficient performance.

On Chip Program ROM Width: 32

32-bit wide on-chip program ROM for efficient program storage.

No. of I/O Lines: 85

Provides ample input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers PIC32MX570F512L-I/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(4), UART(5)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX570F512L-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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