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PIC32MX550F256L-I/PF

Microchip Technology

PIC32MX550F256L-I/PF by Microchip Technology

PIC32MX550F256L-I/PF by Microchip Technology is a 32-bit microcontroller with 3.6V max supply voltage, 40MHz clock frequency, and 48-Ch 10-Bit ADCs. Ideal for industrial applications, it features 85 I/O lines, low power mode support, and multiple connectivity options like I2C(2), SPI(4), UART(5).

Median Price

$6.800

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 180 parts In-Stock

1+ parts

$3.910

100+ parts

$3.830

1k+ parts

-

10k+ parts

-

180

$3.910

$3.830

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-

Microchip Technology

USA . 1,175 parts In-Stock

1+ parts

$6.800

100+ parts

$5.650

1k+ parts

$5.200

10k+ parts

$4.950

1,175

$6.800

$5.650

$5.200

$4.950

DigiKey

USA . 240 parts In-Stock

1+ parts

$6.800

100+ parts

$5.650

1k+ parts

-

10k+ parts

-

240

$6.800

$5.650

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-

Verical

USA . 173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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173

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-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$5.950

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$5.950

-

-

-

NAC Semi

USA . 990 parts In-Stock

1+ parts

$7.090

100+ parts

$6.430

1k+ parts

$5.880

10k+ parts

-

990

$7.090

$6.430

$5.880

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Vyrian

USA . 7,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,623

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-

-

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Chip Stock

USA . 575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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575

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$5.831

100+ parts

-

1k+ parts

$5.598

10k+ parts

-

100

$5.831

-

$5.598

-

Lixinc

USA . 17,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17,344

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-

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West Coast Incorporated

USA . 6,535 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,535

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Overview

Unlock the power of advanced technology with the Microchip Technology PIC32MX550F256L-I/PF microcontroller. Designed to deliver exceptional performance and reliability, this innovative product is perfect for a wide range of applications in various industries. With its cutting-edge features and high-quality design, this microcontroller offers unmatched value and benefits to customers looking for superior functionality and efficiency. Trust in the expertise of Microchip Technology and experience the difference that the PIC32MX550F256L-I/PF can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, suitable for a wide range of applications.

On Chip Data RAM Width: 32

Offers ample memory space for data storage and processing, enhancing the performance of the microcontroller.

Address Bus Width: 16

Supports efficient data transfer and memory addressing, optimizing overall system speed and performance.

Technical Specifications

Microcontrollers PIC32MX550F256L-I/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(4), UART(5)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX550F256L-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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