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PIC32MX530F128L-50I/PF

Microchip Technology

PIC32MX530F128L-50I/PF by Microchip Technology

PIC32MX530F128L-50I/PF by Microchip: 32-bit RISC CPU, 40 MHz clock, 48-Ch ADC for industrial applications. Features 16384 RAM words, 131072 ROM words, and connectivity options like I2C, SPI, UART. Ideal for low power mode with max supply current of 32 mA.

Median Price

$5.888

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.888

100+ parts

-

1k+ parts

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300

$5.888

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Vyrian

USA . 8,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,429

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,768 parts In-Stock

1+ parts

$5.888

100+ parts

-

1k+ parts

-

10k+ parts

$5.770

5,768

$5.888

-

-

$5.770

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.888

100+ parts

-

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500

$5.888

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$9.977

100+ parts

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442

$9.977

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Ampacity Inc.

Singapore . 610 parts In-Stock

1+ parts

$32.000

100+ parts

-

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610

$32.000

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Corohmni

South Africa . 1,067 parts In-Stock

1+ parts

$46.615

100+ parts

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1k+ parts

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10k+ parts

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1,067

$46.615

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Aztec Data Supply Inc.

USA . 4,018 parts In-Stock

1+ parts

$49.583

100+ parts

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1k+ parts

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4,018

$49.583

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QUARKTWIN TECHNOLOGY LTD

USA . 22,930 parts In-Stock

1+ parts

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100+ parts

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22,930

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RGB Technical Solutions

Ukraine . 6,236 parts In-Stock

1+ parts

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6,236

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Argo Parts USA

USA . 2,111 parts In-Stock

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2,111

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Overview

Unleash the power of innovation with the PIC32MX530F128L-50I/PF by Microchip Technology. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this versatile device delivers exceptional value by providing customers with advanced features and benefits that set it apart from the competition. Take your projects to the next level with the PIC32MX530F128L-50I/PF and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy and efficient PCB assembly.

Maximum Supply Voltage:

3.6 V - Supports a wide range of applications.

On Chip Data RAM Width:

8 - Enhances data processing capabilities.

Screening Level:

TS 16949 - Ensures high quality and reliability.

Package Shape:

SQUARE - Enables efficient use of space on the PCB.

Bit Size:

32 - Offers high computational performance.

No. of Terminals:

100 - Provides ample connectivity options.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - Facilitates compact and sleek designs.

Minimum Supply Voltage:

2.3 V - Allows for operation in low power environments.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments.

CPU Family:

PIC32 - Known for its robust performance and versatility.

No. of External Interrupts:

5 - Enhances responsiveness to external events.

Minimum Operating Temperature:

40 °C - Ideal for harsh operating conditions.

Terminal Finish:

MATTE TIN - Ensures good electrical conductivity.

ADC Channels:

YES - Enables analog sensor integration.

DMA Channels:

YES - Enhances data transfer efficiency.

Terminal Position:

QUAD - Facilitates easy PCB layout.

ROM Words:

131072 - Offers ample storage for program data.

Maximum Seated Height:

1.2 mm - Allows for compact electronic designs.

RAM Words:

16384 - Provides ample memory for data storage.

Width:

14 mm - Compact form factor for space-constrained applications.

Boundary Scan:

YES - Simplifies debugging and testing processes.

Peripherals:

BOD, COMPARATOR(3), DMA(8), POR, RTC, TIMER(5) - Offers a wide range of integrated functionalities.

Maximum Clock Frequency:

40 MHz - Supports high-speed operation.

Peak Reflow Temperature °C:

260 - Ensures reliable soldering during assembly.

Length:

14 mm - Compact form factor for space-efficient designs.

Temperature Grade:

INDUSTRIAL - Suitable for demanding industrial environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - Features a powerful and efficient architecture.

No. of Timers:

5 - Facilitates precise timing operations.

RAM Bytes:

16384 - Provides sufficient memory for data storage.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Facilitates easy soldering and connectivity.

Analog To Digital Convertors:

48-Ch 10-Bit - Enables accurate analog signal conversion.

Maximum Supply Current:

32 mA - Supports power-efficient operation.

Nominal Supply Voltage:

3.3 V - Standard voltage level for compatibility with most systems.

No. of DMA Channels:

8 - Ensures efficient data transfer operations.

PWM Channels:

YES - Enables precise control of pulse-width modulation signals.

Connectivity:

I2C(2), I2S(4), SPI(4), UART(5), USB - Offers versatile communication options.

ROM Programmability:

FLASH - Allows for easy and quick reprogramming.

Terminal Pitch:

0.5 mm - Supports high-density PCB layouts.

Format:

FIXED POINT - Facilitates efficient numerical processing.

Moisture Sensitivity Level (MSL):

3 - Ensures safe handling and storage.

Speed:

50 rpm - Suitable for moderate speed applications.

Low Power Mode:

YES - Enables energy-efficient operation.

On Chip Program ROM Width:

8 - Efficient storage of program code.

No. of I/O Lines:

81 - Provides ample connectivity for external devices.

Technical Specifications

Microcontrollers PIC32MX530F128L-50I/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(4), SPI(4), UART(5), USB

Peripherals:

BOD, COMPARATOR(3), DMA(8), POR, RTC, TIMER(5)

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX530F128L-50I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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