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PIC32MX470F512LT-I/PT

Microchip Technology

PIC32MX470F512LT-I/PT by Microchip Technology

PIC32MX470F512LT-I/PT by Microchip: 32-bit RISC CPU, 80 MHz clock, 28-Ch ADC for industrial applications. Features 131072 RAM bytes, 536576 ROM words, and low power mode. Ideal for IoT devices, automation systems, and embedded control applications.

Median Price

$9.750

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

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$9.750

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Vyrian

USA . 8,610 parts In-Stock

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Chip Stock

USA . 279 parts In-Stock

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279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 467 parts In-Stock

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$9.000

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Continental Prestige Electronics

USA . 2,390 parts In-Stock

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$9.750

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$9.555

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$9.750

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Netroflash

USA . 2,000 parts In-Stock

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$9.750

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$9.555

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$9.750

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Corohmni

South Africa . 921 parts In-Stock

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$17.056

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921

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AZTECH Wire

Italy . 776 parts In-Stock

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$21.350

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Aztec Data Supply Inc.

USA . 4,703 parts In-Stock

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$32.630

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QUARKTWIN TECHNOLOGY LTD

USA . 20,896 parts In-Stock

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Lixinc

USA . 4,167 parts In-Stock

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West Coast Incorporated

USA . 2,533 parts In-Stock

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Argo Parts USA

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Overview

Unlock the potential of your electronic designs with the high-quality PIC32MX470F512LT-I/PT microcontroller from industry leader Microchip Technology. This versatile device offers a wide range of applications in various industries, providing exceptional value and benefits to customers looking for reliable performance and advanced features. With its cutting-edge technology and innovative design, this microcontroller is the perfect solution for your next project, delivering efficiency, precision, and power in a compact package. Experience the difference that Microchip Technology can make for your creations with the PIC32MX470F512LT-I/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options.

On Chip Data RAM Width: 8

A wide data RAM width allows for efficient data storage and processing.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability of the product.

Package Shape: SQUARE

The square package shape simplifies PCB layout and design.

Bit Size: 32

The 32-bit size enables high-speed processing and performance.

Power Supplies (V): 2.5/3.3

Dual power supply options offer versatility in voltage requirements.

No. of Terminals: 100

A high number of terminals allows for multiple connections and interfaces.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact design and easy integration into existing systems.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh conditions.

CPU Family: PIC32

The PIC32 CPU family is known for its high performance and reliability.

No. of External Interrupts: 5

Multiple external interrupts enable real-time responsiveness to external events.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for precise analog-to-digital conversion.

DMA Channels: YES

DMA channels enhance data transfer efficiency and performance.

Terminal Position: QUAD

The quad terminal position ensures secure connections on the PCB.

ROM Words: 536576

The large ROM capacity allows for extensive program storage.

Maximum Seated Height: 1.2 mm

The low maximum seated height saves space in compact designs.

RAM Words: 131072

The large RAM capacity enables efficient data processing and storage.

Width: 12 mm

The compact width of the product enhances flexibility in design and layout.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging during production.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, PWM(5), RTC, TIMER(5), WDT

A wide range of peripherals offers versatile functionality for various applications.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables fast data processing and system performance.

Length: 12 mm

The compact length of the product saves space on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture provides efficient processing and performance.

No. of Timers: 5

Multiple timers allow for precise timekeeping and event scheduling.

RAM Bytes: 131072

The large RAM capacity in bytes supports extensive data processing and storage.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections for reliability.

Analog To Digital Convertors: 28-Ch 10-Bit

The 28-channel 10-bit ADCs allow for precise analog signal conversion.

Maximum Supply Current: 75 mA

The low maximum supply current helps in reducing power consumption.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance.

No. of DMA Channels: 4

Multiple DMA channels enhance data transfer efficiency and speed.

PWM Channels: YES

The presence of PWM channels enables precise control of output signals.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SMBUS, SPI(2), UART(5), USB

Multiple connectivity options offer versatile interfacing capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible program updates.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density packing on the PCB.

Format: FIXED POINT

The fixed-point format simplifies numerical calculations and processing.

Speed: 100 rpm

The high speed of 100 rpm ensures quick data processing and system response.

Low Power Mode: YES

The low power mode helps in conserving energy and extending battery life.

On Chip Program ROM Width: 8

A wide ROM width on the chip supports efficient program storage.

No. of I/O Lines: 81

The high number of I/O lines allows for versatile input/output configurations.

Technical Specifications

Microcontrollers PIC32MX470F512LT-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE 2 DEDICATED DMA CHANNELS

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

536576

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SMBUS, SPI(2), UART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, PWM(5), RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX470F512LT-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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