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PIC32MX450F256L-120/PF

Microchip Technology

PIC32MX450F256L-120/PF by Microchip Technology

PIC32MX450F256L-120/PF by Microchip: 32-bit RISC CPU, 120 MHz clock, 28-Ch ADC for industrial automation. Features 5 timers, 6 DMA channels, and multiple connectivity options. Ideal for low power applications with CMOS technology and FLASH ROM programmability.

Median Price

$7.573

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$7.573

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61

$7.573

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Vyrian

USA . 8,641 parts In-Stock

1+ parts

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8,641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,005 parts In-Stock

1+ parts

$7.573

100+ parts

-

1k+ parts

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10k+ parts

$7.422

5,005

$7.573

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-

$7.422

AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$9.667

100+ parts

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812

$9.667

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

1+ parts

$19.000

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1,289

$19.000

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Fulton Briggs Corp.

USA . 3,367 parts In-Stock

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3,367

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Argo Parts USA

USA . 2,926 parts In-Stock

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2,926

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$7.422

1k+ parts

$7.194

10k+ parts

$7.043

50

-

$7.422

$7.194

$7.043

Overview

Discover the cutting-edge PIC32MX450F256L-120/PF microcontroller by industry leader Microchip Technology. This versatile device offers unparalleled performance and reliability for a wide range of applications. With advanced features like high-speed processing, extensive connectivity options, and low power modes, this microcontroller empowers customers to create innovative solutions with ease. Trust in the quality and expertise of Microchip Technology to take your projects to the next level. Elevate your designs with the PIC32MX450F256L-120/PF and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and resistance to external elements, ensuring the longevity and reliability of the product.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs, making it versatile for various applications.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows the microcontroller to process analog signals from sensors or other devices, enabling accurate data acquisition and processing.

Maximum Clock Frequency: 120 MHz

High maximum clock frequency of 120 MHz enables fast and efficient performance, making it suitable for applications requiring quick response times or high-speed processing.

Connectivity: I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(5), USB

Multiple connectivity options such as UART, USB, SPI, and more provide flexibility in interfacing with other devices, enhancing the versatility of the microcontroller for different applications.

Technical Specifications

Microcontrollers PIC32MX450F256L-120/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

AEC-Q100 REVH (GRADE 2 -40 CEL TO +105 CEL) PLANNED

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

120 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

274432

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

84 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(6), POR, PWM(5), RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX450F256L-120/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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