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PIC32MX270F256DT-I/ML

Microchip Technology

PIC32MX270F256DT-I/ML by Microchip Technology

PIC32MX270F256DT-I/ML by Microchip: 32-bit RISC CPU, 50 MHz clock, 13-Ch ADC. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like USB, I2C, SPI. Low power mode and extensive peripheral support make it versatile for various embedded systems.

Median Price

$6.425

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$6.425

100+ parts

-

1k+ parts

-

10k+ parts

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27

$6.425

-

-

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Vyrian

USA . 6,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,936

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$5.861

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$5.861

-

-

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Continental Prestige Electronics

USA . 2,861 parts In-Stock

1+ parts

$6.425

100+ parts

-

1k+ parts

-

10k+ parts

$6.296

2,861

$6.425

-

-

$6.296

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$6.425

100+ parts

$6.104

1k+ parts

$5.799

10k+ parts

$5.718

100

$6.425

$6.104

$5.799

$5.718

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$6.553

100+ parts

$6.553

1k+ parts

$6.553

10k+ parts

-

1,000

$6.553

$6.553

$6.553

-

Semicontronic

India . 145 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

145

$16.000

$15.600

$15.520

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Ampacity Inc.

Singapore . 1,354 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

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10k+ parts

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1,354

$34.000

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Aztec Data Supply Inc.

USA . 4,526 parts In-Stock

1+ parts

$40.800

100+ parts

-

1k+ parts

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4,526

$40.800

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$41.576

100+ parts

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44

$41.576

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West Coast Incorporated

USA . 5,302 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,302

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Argo Parts USA

USA . 1,776 parts In-Stock

1+ parts

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100+ parts

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1,776

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology PIC32MX270F256DT-I/ML microcontroller. Designed by a trusted manufacturer, this versatile device offers unmatched performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value and benefits to customers seeking high-quality solutions. Experience seamless connectivity, advanced peripherals, and low power mode capabilities that set this microcontroller apart from the rest. Trust Microchip Technology to provide you with the tools you need to bring your innovative ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This makes the product lightweight and durable.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

On Chip Data RAM Width: 8

Efficient data handling capabilities.

Screening Level: TS 16949

Indicates high quality and reliability standards.

Package Shape: SQUARE

Space-saving design for compact electronic devices.

Bit Size: 32

Supports complex calculations and processes.

No. of Terminals: 44

Sufficient connectivity options for various interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile packaging options suitable for different applications.

Minimum Supply Voltage: 2.3 V

Allows for operation in low power scenarios.

Maximum Operating Temperature: 85 °C

Ensures stable performance in varying environmental conditions.

CPU Family: PIC32

Known for high performance and reliability in microcontroller applications.

No. of External Interrupts: 5

Enables quick response to external events.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal coating.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention.

Terminal Position: QUAD

Easy installation and secure connection.

ROM Words: 262144

Large memory capacity for storing program instructions.

Maximum Seated Height: 1 mm

Low profile design for slim electronic devices.

RAM Words: 65536

Sufficient memory for data storage and processing.

Width: 8 mm

Compact size for integration into small electronic systems

Boundary Scan: YES

Simplifies testing and debugging during development phase.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Comprehensive set of peripheral interfaces for versatile applications.

Maximum Clock Frequency: 50 MHz

Supports high-speed processing and data transfer.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High temperature tolerance for soldering operations.

Length: 8 mm

Compact form factor for space-constrained designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Ideal for embedded system control applications.

No. of Timers: 5

Enables precise timing and scheduling functionalities.

RAM Bytes: 65536

Sufficient random access memory for data storage and retrieval.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: NO LEAD

Environmentally friendly and RoHS compliant.

Analog To Digital Convertors: 13-Ch 10-Bit

Versatile analog input capabilities with high resolution.

Maximum Supply Current: 37 mA

Efficient power usage for battery-operated devices.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with various components.

No. of DMA Channels: 6

Multiple channels for simultaneous data transfers.

PWM Channels: YES

Enables precise control of pulse width modulation signals.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Diverse communication interfaces for integration with other devices.

ROM Programmability: FLASH

Easily reprogrammable memory for firmware updates.

Terminal Pitch: 0.65 mm

Suitable for fine-pitch PCB layouts.

Format: FIXED POINT

Efficient data representation for numerical calculations.

Speed: 40 rpm

Suitable for applications with moderate speed requirements.

Low Power Mode: YES

Conserves energy and extends battery life.

On Chip Program ROM Width: 8

Efficient program storage and execution capabilities.

No. of I/O Lines: 33

Sufficient input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers PIC32MX270F256DT-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

33

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256DT-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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