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PIC32MX270F256B-V/ML

Microchip Technology

PIC32MX270F256B-V/ML by Microchip Technology

PIC32MX270F256B-V/ML by Microchip: 32-bit microcontroller with 40 MHz clock, 65536 RAM bytes, and 262144 ROM words. Ideal for industrial applications requiring low power mode, featuring 9-Ch ADCs, 4 DMA channels, and various connectivity options like I2C, SPI, UART.

Median Price

$5.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,525 parts In-Stock

1+ parts

$5.520

100+ parts

$4.600

1k+ parts

$4.230

10k+ parts

$4.010

1,525

$5.520

$4.600

$4.230

$4.010

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$5.520

100+ parts

$4.600

1k+ parts

$4.590

10k+ parts

-

183

$5.520

$4.600

$4.590

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 28 parts In-Stock

1+ parts

$5.045

100+ parts

-

1k+ parts

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10k+ parts

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28

$5.045

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-

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NAC Semi

USA . 1,220 parts In-Stock

1+ parts

$5.740

100+ parts

$5.200

1k+ parts

$4.760

10k+ parts

-

1,220

$5.740

$5.200

$4.760

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Vyrian

USA . 8,869 parts In-Stock

1+ parts

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8,869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 269 parts In-Stock

1+ parts

$4.690

100+ parts

-

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269

$4.690

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-

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Continental Prestige Electronics

USA . 1,616 parts In-Stock

1+ parts

$5.045

100+ parts

-

1k+ parts

-

10k+ parts

$4.945

1,616

$5.045

-

-

$4.945

AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$14.457

100+ parts

-

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639

$14.457

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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QUARKTWIN TECHNOLOGY LTD

USA . 7,901 parts In-Stock

1+ parts

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7,901

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RGB Technical Solutions

Ukraine . 6,589 parts In-Stock

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6,589

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Argo Parts USA

USA . 2,734 parts In-Stock

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2,734

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Overview

Unleash the power of innovation with the Microchip Technology PIC32MX270F256B-V/ML microcontroller. Designed to deliver top-notch performance and reliability, this cutting-edge device is perfect for a wide range of applications in the industrial sector, automotive industry, IoT, and more. With its advanced features and high-quality construction, customers can expect seamless operation, low power consumption, and exceptional value for their projects. Upgrade your technology with the PIC32MX270F256B-V/ML and experience the difference today.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache enhances the performance of the microcontroller by reducing the time needed to access frequently used data, improving overall efficiency.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

No. of Timers: 7

The presence of 7 timers provides ample timing and scheduling capabilities, making it suitable for applications requiring precise timing control.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the microcontroller efficient and reliable.

Analog To Digital Convertors: 9-Ch 10-Bit

With 9 channels and 10-bit resolution, the microcontroller can accurately convert analog signals to digital data, enabling precise measurements and sensor readings.

Technical Specifications

Microcontrollers PIC32MX270F256B-V/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

19

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

PIC32MX270F256B-V/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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