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PIC32MX250F128BT-I/SO

Microchip Technology

PIC32MX250F128BT-I/SO by Microchip Technology

The Microchip Technology PIC32MX250F128BT-I/SO is a 32-bit microcontroller with 131072 ROM words and 32768 RAM words. It operates at a max clock frequency of 40 MHz, making it suitable for industrial applications requiring high-speed processing. With connectivity options like I2C, SPI, and UART, it offers versatile interfacing capabilities for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,814 parts In-Stock

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Nova Conductors

Japan . 94 parts In-Stock

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AZTECH Wire

Italy . 614 parts In-Stock

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$10.592

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Ampacity Inc.

Singapore . 201 parts In-Stock

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$13.000

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Microchip USA

USA . 3,985 parts In-Stock

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$28.574

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Aztec Data Supply Inc.

USA . 103 parts In-Stock

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$41.660

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Corohmni

South Africa . 319 parts In-Stock

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$78.455

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Montano Global Distributors

Canada . 8,229 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,864 parts In-Stock

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LMD Electronica

Estonia . 6,105 parts In-Stock

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NIA Electronics

USA . 3,916 parts In-Stock

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Ledger Components

France . 3,916 parts In-Stock

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Argo Parts USA

USA . 2,973 parts In-Stock

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Continental Prestige Electronics

USA . 2,812 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Enhance your electronic projects with the PIC32MX250F128BT-I/SO microcontroller from Microchip Technology. As a trusted leader in the industry, Microchip delivers top-quality products that guarantee reliability and performance. Ideal for various applications, this microcontroller offers powerful features such as multiple ADC channels, PWM channels, and connectivity options like I2C and SPI. Experience the value of seamless integration, efficient power consumption, and advanced functionality with the PIC32MX250F128BT-I/SO. Upgrade your projects today and unlock endless possibilities with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and execution of instructions, making the microcontroller a high-speed and reliable option.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the microcontroller's program memory, facilitating faster development and debugging processes.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Versatile connectivity options allow for seamless integration with various communication protocols and devices, enhancing the microcontroller's usability in diverse applications.

Maximum Clock Frequency: 40 MHz

High clock frequency supports fast data processing and execution, making the microcontroller suitable for time-critical applications that require quick response times.

Technical Specifications

Microcontrollers PIC32MX250F128BT-I/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

19

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

PIC32MX250F128BT-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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