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PIC32MX230F128L-50I/PT

Microchip Technology

PIC32MX230F128L-50I/PT by Microchip Technology

PIC32MX230F128L-50I/PT by Microchip: 32-bit RISC CPU, 131072 ROM words, 16384 RAM bytes. Ideal for industrial applications requiring high-speed processing, with peripherals like BOR, PWM, and USB connectivity. Operates at up to 50 MHz clock frequency in a compact square package with low power mode.

Median Price

$5.193

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$5.193

100+ parts

-

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550

$5.193

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Vyrian

USA . 4,686 parts In-Stock

1+ parts

-

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4,686

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,544 parts In-Stock

1+ parts

$5.193

100+ parts

-

1k+ parts

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10k+ parts

$5.089

6,544

$5.193

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-

$5.089

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.193

100+ parts

-

1k+ parts

$4.933

10k+ parts

$4.829

500

$5.193

-

$4.933

$4.829

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$5.529

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-

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382

$5.529

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$22.276

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-

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208

$22.276

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Aztec Data Supply Inc.

USA . 138 parts In-Stock

1+ parts

$50.050

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138

$50.050

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Argo Parts USA

USA . 4,620 parts In-Stock

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4,620

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West Coast Incorporated

USA . 2,339 parts In-Stock

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2,339

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Overview

Unlock endless possibilities with the Microchip Technology PIC32MX230F128L-50I/PT microcontroller. Known for its reliability and high-quality design, this product is perfect for a wide range of applications in the industrial sector. With features like low power mode, DMA channels, and multiple connectivity options, customers can expect seamless operation and enhanced performance. Invest in the future of technology with Microchip Technology and experience the value and benefits that this advanced microcontroller brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions.

No. of Timers: 5

Having 5 timers allows for precise timing and control in various applications, enhancing the functionality of the microcontroller.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making this microcontroller suitable for applications requiring sensor interfacing and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers improved performance and power efficiency, making it a good choice for embedded systems where speed is crucial.

Connectivity: I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5), USB

A wide range of connectivity options such as I2C, SPI, UART, and USB allows for easy communication with other devices, expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers PIC32MX230F128L-50I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5), USB

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX230F128L-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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