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PIC32MX230F128H-I/MR

Microchip Technology

PIC32MX230F128H-I/MR by Microchip Technology

PIC32MX230F128H-I/MR by Microchip: 32-bit RISC CPU, 3.6V max supply, 40MHz clock freq. Ideal for industrial applications with ADC(28-Ch), PWM, UART(4), SPI(3) connectivity and low power mode support. Compact chip carrier package with 64 terminals and extensive peripheral options for efficient microcontroller operations.

Median Price

$4.380

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,480 parts In-Stock

1+ parts

$4.380

100+ parts

$3.620

1k+ parts

$3.340

10k+ parts

$3.190

3,480

$4.380

$3.620

$3.340

$3.190

Mouser Electronics

USA . 194 parts In-Stock

1+ parts

$4.380

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$3.620

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$3.610

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194

$4.380

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$3.610

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DigiKey

USA . 175 parts In-Stock

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$4.380

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$3.620

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175

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$3.620

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Verical

USA . 50 parts In-Stock

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NAC Semi

USA . 2,800 parts In-Stock

1+ parts

$4.540

100+ parts

$4.120

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$3.770

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2,800

$4.540

$4.120

$3.770

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TME

Poland . 50 parts In-Stock

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$6.260

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$5.580

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Vyrian

USA . 3,782 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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Ampacity Inc.

Singapore . 442 parts In-Stock

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$3.720

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West Coast Incorporated

USA . 8,352 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

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Overview

Elevate your projects with the PIC32MX230F128H-I/MR microcontroller from industry leader Microchip Technology. This powerful device offers unmatched performance and reliability, making it ideal for a wide range of applications. With advanced features like multiple ADC channels, DMA support, and low power modes, this microcontroller provides exceptional value and flexibility for your designs. Trust Microchip Technology to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, offering flexibility in power supply options.

Address Bus Width: 16

Enables efficient memory addressing, enhancing the performance of the microcontroller.

Bit Size: 32

32-bit architecture allows for more complex calculations and processing tasks.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher operating temperatures.

No. of External Interrupts: 5

Multiple interrupt channels allow for the microcontroller to quickly respond to external events.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to interface with analog sensors and signals.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing and response times.

No. of Timers: 7

Multiple timers provide flexibility for timing and scheduling tasks.

Analog To Digital Convertors: 28-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for precise analog signal conversion.

Technical Specifications

Microcontrollers PIC32MX230F128H-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

49

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

RAM Words:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX230F128H-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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