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PIC32MX130F256B-I/ML

Microchip Technology

PIC32MX130F256B-I/ML by Microchip Technology

PIC32MX130F256B-I/ML by Microchip: 32-bit RISC CPU, 50 MHz clock, 10-Ch 10-Bit ADC for industrial applications. Features 5 timers, 4 DMA channels, and peripherals like PWM and RTC. Operates at -40 to 85 °C with low power mode option.

Median Price

$3.790

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,891 parts In-Stock

1+ parts

$3.790

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$3.150

1k+ parts

$2.900

10k+ parts

$2.760

1,891

$3.790

$3.150

$2.900

$2.760

DigiKey

USA . 305 parts In-Stock

1+ parts

$3.790

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$3.150

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305

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$3.150

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Mouser Electronics

USA . 244 parts In-Stock

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$3.790

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$3.150

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$3.140

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244

$3.790

$3.150

$3.140

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Distributors (In-Stock)

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Nova Conductors

Japan . 44 parts In-Stock

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$3.440

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$3.440

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NAC Semi

USA . 1,525 parts In-Stock

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$3.940

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$3.570

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$3.270

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1,525

$3.940

$3.570

$3.270

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Chip Stock

USA . 2,886 parts In-Stock

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Vyrian

USA . 2,327 parts In-Stock

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Semtec, LLC

USA . 5 parts In-Stock

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Semicontronic

India . 610 parts In-Stock

1+ parts

$3.220

100+ parts

$3.140

1k+ parts

$3.123

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610

$3.220

$3.140

$3.123

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Corohmni

South Africa . 126 parts In-Stock

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$3.347

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126

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Argo Parts USA

USA . 4,310 parts In-Stock

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$3.440

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Continental Prestige Electronics

USA . 2,336 parts In-Stock

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$3.440

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$3.371

2,336

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Netroflash

USA . 50 parts In-Stock

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$3.440

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$3.440

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Ampacity Inc.

Singapore . 2,299 parts In-Stock

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$7.010

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2,299

$7.010

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AZTECH Wire

Italy . 227 parts In-Stock

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$18.293

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Aztec Data Supply Inc.

USA . 4,137 parts In-Stock

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$49.990

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Lixinc

USA . 17,048 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Fulton Briggs Corp.

USA . 3,909 parts In-Stock

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Overview

Unlock the potential of your next project with the Microchip Technology PIC32MX130F256B-I/ML microcontroller. With a trusted manufacturer like Microchip Technology, this high-quality product offers unmatched value and benefits. Ideal for a wide range of applications, this powerful microcontroller boasts features like low power mode, multiple PWM channels, and connectivity options including I2C, SPI, and UART. Trust in the reliability and performance of Microchip Technology to bring your designs to life seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for high voltage operation, increasing flexibility in design.

CPU Family: PIC32

PIC32 is a popular and well-established CPU family known for its performance and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing, making the microcontroller fast and responsive.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Multiple connectivity options allow for easy integration with other devices and systems.

Technical Specifications

Microcontrollers PIC32MX130F256B-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

PIC32MX130F256B-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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