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PIC32MX130F128H-50I/MR

Microchip Technology

PIC32MX130F128H-50I/MR by Microchip Technology

PIC32MX130F128H-50I/MR by Microchip: 32-bit RISC CPU, 40 MHz clock, 28-Ch ADC for industrial applications. Features 16384 RAM bytes, 131072 ROM words, and connectivity options like I2C, SPI, UART. Ideal for low power mode with DMA support and 53 I/O lines.

Median Price

$4.066

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$4.066

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Vyrian

USA . 5,206 parts In-Stock

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Continental Prestige Electronics

USA . 1,414 parts In-Stock

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$4.066

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$3.985

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Argo Parts USA

USA . 273 parts In-Stock

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$4.066

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AZTECH Wire

Italy . 345 parts In-Stock

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$11.093

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Microchip USA

USA . 7,333 parts In-Stock

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$26.117

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Ampacity Inc.

Singapore . 1,426 parts In-Stock

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$32.000

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Marpe Global Electronics

Taiwan . 6,033 parts In-Stock

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QualityLine Systems

Poland . 3,696 parts In-Stock

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XL Components Corporation

Australia . 1,556 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$3.985

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$3.863

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$3.782

500

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$3.863

$3.782

Overview

Unlock the power of innovation with the PIC32MX130F128H-50I/MR by Microchip Technology. As a leader in the microcontroller industry, Microchip Technology delivers high-quality products that redefine performance and reliability. Ideal for a wide range of applications, this microcontroller offers unmatched value with its robust features and advanced capabilities. Experience seamless connectivity, low power modes, and superior speed with the PIC32MX130F128H-50I/MR. Elevate your projects to new heights with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for package body ensures durability and resistance to external elements, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements and is compatible with a wide range of applications.

RAM Words: 16384

The large RAM size of 16384 words allows for efficient storage and processing of data, enabling the microcontroller to handle complex tasks effectively.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller with various peripherals, this product offers high performance and flexibility in handling different input/output operations.

Analog To Digital Convertors: 28-Ch 10-Bit

Having 28 analog to digital converters with 10-bit resolution each provides accurate and precise conversion of analog signals, making it suitable for sensor interfacing and data acquisition applications.

Connectivity: I2C(2), I2S(3), SPI(3), UART(4)

The multiple connectivity options such as I2C, I2S, SPI, and UART allow for easy interfacing with a variety of external devices and communication protocols, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers PIC32MX130F128H-50I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(3), SPI(3), UART(4)

Peripherals:

BOD, COMPARATOR(3), DMA(4), POR, RTC, TIMER(5)

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX130F128H-50I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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