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PIC32MX120F064H-V/PT

Microchip Technology

PIC32MX120F064H-V/PT by Microchip Technology

PIC32MX120F064H-V/PT by Microchip: 32-bit RISC CPU, 40 MHz clock, 28-Ch ADC for industrial applications. Features 8192 RAM bytes, 65536 ROM words, and connectivity options like I2C, SPI, UART. Ideal for low power mode with max supply current of 32 mA.

Median Price

$3.993

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$3.993

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Vyrian

USA . 5,131 parts In-Stock

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Continental Prestige Electronics

USA . 6,205 parts In-Stock

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$3.993

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$3.913

6,205

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$3.913

Argo Parts USA

USA . 4,467 parts In-Stock

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$3.993

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Netroflash

USA . 1,000 parts In-Stock

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AZTECH Wire

Italy . 840 parts In-Stock

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$14.716

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840

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Ampacity Inc.

Singapore . 804 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 3,836 parts In-Stock

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$84.180

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3,836

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Corohmni

South Africa . 801 parts In-Stock

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$84.975

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QUARKTWIN TECHNOLOGY LTD

USA . 11,861 parts In-Stock

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Fulton Briggs Corp.

USA . 8,028 parts In-Stock

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Overview

Experience the power of innovation with the PIC32MX120F064H-V/PT by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality microcontrollers that excel in a variety of applications. With advanced features and reliable performance, the PIC32MX120F064H-V/PT offers unparalleled value to customers. Whether you're looking to enhance your industrial processes or develop cutting-edge technology, this microcontroller provides the tools and capabilities you need to succeed. Trust Microchip Technology to bring your ideas to life with the PIC32MX120F064H-V/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more versatile use in various electronic circuits.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of external events without CPU intervention, improving overall performance.

Peripherals: BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Wide range of peripherals like timers, PWM, DMA, and comparators offer enhanced functionality and flexibility for various applications.

Maximum Clock Frequency: 40 MHz

Higher clock frequency enables faster processing speeds, making it suitable for applications requiring quick and real-time data processing.

Analog To Digital Convertors: 28-Ch 10-Bit

Multiple ADC channels with high resolution provide accurate analog to digital conversion for sensor interfacing and data acquisition.

Connectivity: I2C(2), I2S(3), IRDA, LIN, SPI(3), UART(4)

Various connectivity options like I2C, SPI, and UART allow easy communication with external peripherals and devices, enhancing system integration.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the device, facilitating firmware updates and customization.

Low Power Mode: YES

Low power mode helps in reducing power consumption during idle or standby periods, extending battery life in battery-operated devices.

Technical Specifications

Microcontrollers PIC32MX120F064H-V/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(3), IRDA, LIN, SPI(3), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX120F064H-V/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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