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PIC32MX120F064H-V/MR

Microchip Technology

PIC32MX120F064H-V/MR by Microchip Technology

PIC32MX120F064H-V/MR by Microchip: 32-bit RISC CPU, 40 MHz clock, 28-Ch ADC for industrial applications. Features 8192 RAM bytes, 65536 ROM words, and connectivity options like I2C(2), SPI(3). Ideal for low power mode with max supply current of 32 mA.

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 211 parts In-Stock

1+ parts

$4.240

100+ parts

$3.530

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211

$4.240

$3.530

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Distributors (In-Stock)

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Nova Conductors

Japan . 36 parts In-Stock

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$4.040

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36

$4.040

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Vyrian

USA . 8,673 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$3.600

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139

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Argo Parts USA

USA . 4,110 parts In-Stock

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$4.040

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Continental Prestige Electronics

USA . 3,870 parts In-Stock

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$4.040

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$3.959

3,870

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$3.959

Microchip USA

USA . 1,641 parts In-Stock

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$28.925

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1,641

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Corohmni

South Africa . 54 parts In-Stock

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$59.853

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54

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Aztec Data Supply Inc.

USA . 3,233 parts In-Stock

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$79.310

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Lixinc

USA . 7,183 parts In-Stock

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Fulton Briggs Corp.

USA . 3,633 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the power and innovation of the PIC32MX120F064H-V/MR microcontroller by Microchip Technology. Designed with precision and reliability, this product offers a wide range of applications in various industries. With features like low power mode, multiple peripherals, and high clock frequency, this microcontroller provides unmatched performance and efficiency. Trust in Microchip Technology to deliver cutting-edge solutions that meet your needs and exceed your expectations. Experience the difference with the PIC32MX120F064H-V/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly complexity.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Bit Size: 32

32-bit architecture provides enhanced computational power and efficiency, suitable for complex applications.

ROM Words: 65536

Large ROM capacity allows for extensive program storage, enabling the implementation of sophisticated algorithms and functions.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in harsh environments and industrial applications.

Connectivity: I2C(2), I2S(3), SPI(3), UART(4)

Multiple connectivity options enable seamless communication with other devices and peripherals, enhancing the versatility of the microcontroller.

PWM Channels: YES

Built-in PWM channels allow for precise control of analog signals, essential for applications such as motor control and audio modulation.

Low Power Mode: YES

Low power mode functionality helps to optimize power consumption, extending battery life and reducing energy costs in portable and IoT devices.

Technical Specifications

Microcontrollers PIC32MX120F064H-V/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(3), SPI(3), UART(4)

Peripherals:

BOD, COMPARATOR(3), DMA(4), POR, RTC, TIMER(5)

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX120F064H-V/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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