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PIC24HJ16GP304-I/ML

Microchip Technology

PIC24HJ16GP304-I/ML by Microchip Technology

PIC24HJ16GP304-I/ML by Microchip: 16-bit, 40 MHz CPU with 2048 bytes RAM. Features 13-Ch 12-Bit ADC, Flash ROM, and BOD/POR peripherals. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C/SPI/UART.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,885 parts In-Stock

1+ parts

$4.760

100+ parts

$3.940

1k+ parts

$3.590

10k+ parts

$3.430

1,885

$4.760

$3.940

$3.590

$3.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$4.200

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$4.200

-

-

-

NAC Semi

USA . 1,530 parts In-Stock

1+ parts

$4.880

100+ parts

$4.430

1k+ parts

$4.050

10k+ parts

-

1,530

$4.880

$4.430

$4.050

-

Vyrian

USA . 4,651 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,651

-

-

-

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EMSNET

USA . 40 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,640 parts In-Stock

1+ parts

$1.948

100+ parts

-

1k+ parts

$1.870

10k+ parts

$1.870

3,640

$1.948

-

$1.870

$1.870

Aranea Global

USA . 100 parts In-Stock

1+ parts

$4.116

100+ parts

-

1k+ parts

$3.951

10k+ parts

-

100

$4.116

-

$3.951

-

AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$10.840

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$10.840

-

-

-

Ampacity Inc.

Singapore . 278 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

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278

$32.000

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-

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Lixinc

USA . 4,412 parts In-Stock

1+ parts

-

100+ parts

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4,412

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-

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RGB Technical Solutions

Ukraine . 3,163 parts In-Stock

1+ parts

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100+ parts

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3,163

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-

Overview

Unleash the power of innovation with the PIC24HJ16GP304-I/ML by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-quality microcontrollers that cater to a wide range of applications. Experience seamless performance and reliability with this versatile product that offers exceptional value to customers. Elevate your projects with the advantages and benefits of the PIC24HJ16GP304-I/ML, setting new standards in efficiency and functionality. Let your creativity soar with Microchip's cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring reliable performance.

Maximum Supply Voltage: 3.6V

Allows for flexibility in power supply options and compatibility with various voltage sources.

Bit Size: 16

16-bit architecture offers enhanced processing capabilities and improved performance for the microcontroller.

ADC Channels: YES

Built-in analog to digital converters enable the microcontroller to interface with and process analog signals effectively.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined operation, making the microcontroller an optimal choice for embedded systems.

RAM Bytes: 2048

Ample RAM capacity allows for efficient data storage and processing, enhancing the overall performance of the microcontroller.

Connectivity: I2C, IRDA, LIN, SPI, UART

Support for multiple communication protocols enables seamless integration with various devices and systems, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers PIC24HJ16GP304-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

PIC24

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

35

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

5461

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

13-Ch 12-Bit

Trade Compliance

PIC24HJ16GP304-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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