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PIC24FJ64GA702-E/SS

Microchip Technology

PIC24FJ64GA702-E/SS by Microchip Technology

PIC24FJ64GA702-E/SS by Microchip: 16-bit, 48 MHz microcontroller with 16384 bytes RAM, 10-Ch 12-Bit ADC, and 3 timers. Ideal for automotive applications due to TS16949 screening level and -40 to 125 °C operating temperature range. Features include BOR, DMA(6), RTCC, SPI(3), UART(2).

Median Price

$1.600

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

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33

$1.600

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Vyrian

USA . 2,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,892

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.600

100+ parts

$1.568

1k+ parts

-

10k+ parts

-

100

$1.600

$1.568

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AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$14.604

100+ parts

-

1k+ parts

-

10k+ parts

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302

$14.604

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Ampacity Inc.

Singapore . 950 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

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10k+ parts

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950

$29.000

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West Coast Incorporated

USA . 2,406 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,406

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Overview

Discover the cutting-edge PIC24FJ64GA702-E/SS microcontroller by Microchip Technology, a leader in quality and innovation. Ideal for a wide range of applications, this powerful device offers unparalleled value with its advanced features and high performance. With a focus on reliability and efficiency, this product provides customers with a seamless experience and endless possibilities. Upgrade your projects with the best in the industry and unleash the full potential of your designs with the PIC24FJ64GA702-E/SS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

The microcontroller can operate at a relatively high supply voltage, providing flexibility in power supply options.

ADC Channels: YES

The presence of analog to digital converters allows the microcontroller to interface with analog sensors and signals.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, RTCC, TIMER(3), WDT

The microcontroller comes equipped with a variety of peripherals, enhancing its functionality and versatility for different applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables fast processing and response times, making the microcontroller suitable for tasks that require quick computations.

Temperature Grade: AUTOMOTIVE

The microcontroller is designed to operate in automotive environments, ensuring reliable performance under temperature variations and harsh conditions.

ROM Programmability: FLASH

The use of flash ROM allows for easy reprogramming and updating of the microcontroller's firmware, making it adaptable to changing requirements.

Connectivity: I2C(2), LIN, SPI(3),UART(2)

The microcontroller offers multiple communication interfaces, enabling seamless connectivity with other devices and systems in a network.

Technical Specifications

Microcontrollers PIC24FJ64GA702-E/SS attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

22

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LIN, SPI(3),UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, RTCC, TIMER(3), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

PIC24FJ64GA702-E/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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