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PIC24FJ64GA102T-I/ML

Microchip Technology

PIC24FJ64GA102T-I/ML by Microchip Technology

PIC24FJ64GA102T-I/ML by Microchip: 16-bit, 32MHz CPU with 65536 ROM words and 8192 RAM bytes. Ideal for industrial applications, featuring 10-Ch 10-Bit ADCs, PWM channels, and connectivity options like I2C, SPI, UART.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,846 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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AZTECH Wire

Italy . 686 parts In-Stock

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$16.920

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$22.000

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Corohmni

South Africa . 118 parts In-Stock

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$57.220

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QUARKTWIN TECHNOLOGY LTD

USA . 8,014 parts In-Stock

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NIA Electronics

USA . 7,184 parts In-Stock

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Ledger Components

France . 7,184 parts In-Stock

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LMD Electronica

Estonia . 7,010 parts In-Stock

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Montano Global Distributors

Canada . 5,673 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,371 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Step into the future of microcontrollers with the PIC24FJ64GA102T-I/ML by Microchip Technology. As a trusted manufacturer in the industry, Microchip delivers top-quality products that exceed expectations. This microcontroller offers a wide range of applications, providing customers with unparalleled value and benefits. With features such as low power mode, high-speed operation, and multiple peripherals, this product is perfect for a variety of projects. Experience the advantages of cutting-edge technology with the PIC24FJ64GA102T-I/ML and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on a PCB, making it suitable for mass production.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and power consumption for various applications.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

ROM Words: 65536

Sufficient memory capacity for storing program instructions and data for most applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, resulting in high performance.

Analog To Digital Convertors: 10-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate and precise analog signal processing.

Connectivity: I2C(2), SPI(2), UART(2)

Offers versatile communication interfaces for connecting with a wide range of peripherals and devices.

Low Power Mode: YES

Enables energy-efficient operation and prolongs battery life in portable devices.

Technical Specifications

Microcontrollers PIC24FJ64GA102T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

21

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(2), UART(2)

Peripherals:

ANALOG COMPARATOR(3), BOD, CTMU, CRC, POR, PWM(5), RTCC, TIMER(7), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

PIC24FJ64GA102T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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