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PIC24FJ256GB210-I/BG

Microchip Technology

PIC24FJ256GB210-I/BG by Microchip Technology

PIC24FJ256GB210-I/BG by Microchip: 16-bit, 32MHz MCU with 262144 ROM words, 98304 RAM bytes. Ideal for industrial applications requiring low power mode, featuring 24-Ch ADC, USB connectivity and 9 PWM channels.

Median Price

$10.190

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 184 parts In-Stock

1+ parts

$10.090

100+ parts

$8.380

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184

$10.090

$8.380

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Mouser Electronics

USA . 100 parts In-Stock

1+ parts

$10.090

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100

$10.090

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Master Electronics

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$10.290

1k+ parts

$7.980

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160

-

$10.290

$7.980

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Verical

USA . 160 parts In-Stock

1+ parts

-

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$19.285

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160

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$19.285

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Distributors (In-Stock)

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Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$9.705

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-

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31

$9.705

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Vyrian

USA . 6,909 parts In-Stock

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6,909

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Chip Stock

USA . 5,200 parts In-Stock

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5,200

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IBS Electronics

USA . 160 parts In-Stock

1+ parts

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100+ parts

$14.432

1k+ parts

$11.192

10k+ parts

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160

-

$14.432

$11.192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 134 parts In-Stock

1+ parts

$5.040

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134

$5.040

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Continental Prestige Electronics

USA . 1,959 parts In-Stock

1+ parts

$9.705

100+ parts

-

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$9.511

1,959

$9.705

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$9.511

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.705

100+ parts

$9.511

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1,000

$9.705

$9.511

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Aztec Data Supply Inc.

USA . 257 parts In-Stock

1+ parts

$56.690

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257

$56.690

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Corohmni

South Africa . 182 parts In-Stock

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$66.100

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182

$66.100

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Lixinc

USA . 16,659 parts In-Stock

1+ parts

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16,659

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Argo Parts USA

USA . 4,110 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,295 parts In-Stock

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1,295

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Overview

Unleash the power of innovation with the Microchip Technology PIC24FJ256GB210-I/BG microcontroller! Designed by a trusted manufacturer, this versatile device offers a wide range of applications in various industries. Experience seamless connectivity and efficient performance with its advanced features. Elevate your projects with its high-quality components and reliable functionality. Upgrade to the PIC24FJ256GB210-I/BG and unlock endless possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, making it versatile for different power requirements.

On Chip Data RAM Width: 8

Provides sufficient memory for data processing and storage.

Package Shape: SQUARE

Easily fits into standardized mounting layouts, making integration into designs straightforward.

Power Supplies (V): 2.5/3.3

Offers flexibility in power input options, allowing compatibility with a range of power sources.

No. of Terminals: 121

Provides a variety of interfaces for connections, enabling versatility in connecting external components.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Enhances electrical performance and thermal characteristics while reducing package size, ideal for high-density applications.

Minimum Supply Voltage: 2.2 V

Can operate at low voltages, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

CPU Family: PIC24

Part of a well-known and reliable microcontroller family, ensuring compatibility and support.

No. of External Interrupts: 5

Allows for efficient response to external events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable electrical connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

Terminal Position: BOTTOM

Facilitates easy placement and soldering during assembly processes.

ROM Words: 262144

Offers ample program storage capacity for firmware and code.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact device designs.

Width: 10 mm

Compact size enables integration into small form factor devices.

Boundary Scan: YES

Facilitates debugging and testing of circuits during production and maintenance.

Peripherals: BOD, COMPARATOR(3), LVD, POR, PWM(9), RTC, TIMER(7), WDT

Includes a wide range of built-in peripherals for diverse functionality and application support.

Maximum Clock Frequency: 32 MHz

Provides high-speed operation for demanding computational tasks.

Length: 10 mm

Compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs a RISC architecture for efficient processing and performance.

No. of Timers: 7

Provides multiple timer functions for event scheduling and timing operations.

RAM Bytes: 98304

Offers ample random-access memory for data storage and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball grid array design for reliable connections and compact footprint.

Analog To Digital Convertors: 24-Ch 10-Bit

Provides a high number of ADC channels with good resolution for precise analog signal conversion.

Maximum Supply Current: 18 mA

Efficient power usage with low current draw for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and reliable operation.

No. of Serial I/Os: 4

Multiple serial communication interfaces for connecting to other devices and peripherals.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog outputs.

Connectivity: I2C(3), SPI(3), UART(4), USB

Multiple communication options for interfacing with a variety of devices and systems.

ROM Programmability: FLASH

Flash memory technology for reprogrammability and flexibility in updating firmware.

Terminal Pitch: 0.8 mm

Fine pitch design for high-density mounting and space-saving applications.

Format: FIXED POINT

Fixed-point processing for efficient arithmetic operations and numerical accuracy.

Speed: 32 rpm

High clock speed for fast processing and real-time responsiveness.

Low Power Mode: YES

Ability to operate in low power modes for energy-saving and extended battery life.

On Chip Program ROM Width: 8

Dedicated on-chip program memory for storing firmware and executable code.

No. of I/O Lines: 84

Plenty of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers PIC24FJ256GB210-I/BG attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

84

No. of Serial I/Os:

4

No. of Terminals:

121

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SPI(3), UART(4), USB

Peripherals:

BOD, COMPARATOR(3), LVD, POR, PWM(9), RTC, TIMER(7), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

PIC24FJ256GB210-I/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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