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PIC24FJ128GA702T-I/ML

Microchip Technology

PIC24FJ128GA702T-I/ML by Microchip Technology

PIC24FJ128GA702T-I/ML by Microchip: 16-bit RISC CPU, 48 MHz clock, 16384 bytes RAM. Ideal for industrial applications requiring low power mode, with 10-Ch ADC and 6 DMA channels for efficient data processing. Package style: Chip carrier, very thin profile, heat sink/slug.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$1.300

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29

$1.300

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Vyrian

USA . 717 parts In-Stock

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717

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.274

100+ parts

-

1k+ parts

$1.223

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1,000

$1.274

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$1.223

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Continental Prestige Electronics

USA . 6,642 parts In-Stock

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$1.300

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$1.274

6,642

$1.300

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$1.274

Argo Parts USA

USA . 2,515 parts In-Stock

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$1.300

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2,515

$1.300

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AZTECH Wire

Italy . 245 parts In-Stock

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$7.546

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245

$7.546

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Ampacity Inc.

Singapore . 779 parts In-Stock

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$25.000

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779

$25.000

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Aztec Data Supply Inc.

USA . 1,345 parts In-Stock

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$41.835

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1,345

$41.835

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Corohmni

South Africa . 516 parts In-Stock

1+ parts

$78.309

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516

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Lixinc

USA . 13,096 parts In-Stock

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Fulton Briggs Corp.

USA . 2,039 parts In-Stock

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2,039

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Overview

Experience unmatched performance and reliability with the PIC24FJ128GA702T-I/ML microcontroller by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-quality products that exceed expectations. This versatile microcontroller is ideal for a wide range of applications, offering advanced features such as low power mode, PWM channels, and multiple connectivity options. With its high-speed operation and robust design, the PIC24FJ128GA702T-I/ML delivers exceptional value and benefits to customers looking for cutting-edge technology solutions. Elevate your projects with this innovative microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, making the microcontroller versatile.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle more complex operations and calculations efficiently.

ADC Channels: YES

The analog-to-digital converter channels enable the microcontroller to interface with various sensors and input devices.

Maximum Clock Frequency: 48 MHz

High clock frequency allows for fast processing speeds, making the microcontroller suitable for time-sensitive applications.

ROM Words: 131072

Large ROM size provides ample storage for program code and data, accommodating complex algorithms.

No. of Timers: 3

Multiple timers allow for precise timing control in applications such as scheduling tasks, generating waveforms, and measuring intervals.

RAM Bytes: 16384

Sufficient RAM capacity for storing temporary data and variables during program execution, enhancing the microcontroller's performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and reduced power consumption, making the microcontroller energy-efficient.

Technical Specifications

Microcontrollers PIC24FJ128GA702T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

22

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LIN, SPI(3),UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, RTCC, TIMER(3), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

PIC24FJ128GA702T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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