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PIC24FJ1024GB606T-I/MR

Microchip Technology

PIC24FJ1024GB606T-I/MR by Microchip Technology

PIC24FJ1024GB606T-I/MR by Microchip Technology is a 16-bit microcontroller with 8KB RAM and 352256 ROM words. It operates at up to 32MHz, has 16 ADC channels, and offers low power mode. Ideal for industrial applications requiring high-speed processing, analog-to-digital conversion, and multiple serial I/O options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,339 parts In-Stock

1+ parts

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13,339

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 737 parts In-Stock

1+ parts

$4.190

100+ parts

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737

$4.190

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Semicontronic

India . 1,066 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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1,066

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$21.280

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292

$21.280

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Ampacity Inc.

Singapore . 1,571 parts In-Stock

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$33.000

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1,571

$33.000

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RGB Technical Solutions

Ukraine . 6,439 parts In-Stock

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6,439

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Elevate your projects with the PIC24FJ1024GB606T-I/MR by Microchip Technology. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. With advanced features like multiple ADC channels, DMA channels, and PWM channels, this product provides exceptional value and versatility to customers looking to streamline their designs. Trust in Microchip Technology to deliver top-tier quality and innovation, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for packaging, ensuring long-term performance.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for various applications.

Bit Size: 16

Provides sufficient processing power for handling complex tasks efficiently.

No. of Terminals: 64

Offers ample connectivity options for interfacing with other components.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and improved performance.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast execution of instructions and operations.

ADC Channels: YES

Integrated Analog to Digital Converters enable precise analog signal conversion.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and reduce CPU load.

Connectivity: I2C(3), IRDA(2), SPI(3), UART(6), USB

Multiple communication interface options enable connectivity with a wide range of devices.

Speed: 32 rpm

Efficient processing speed for rapid data handling and response times.

Low Power Mode: YES

Supports power-saving modes for energy efficiency and extended battery life.

Technical Specifications

Microcontrollers PIC24FJ1024GB606T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

32768

ROM Words:

352256

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(2), SPI(3), UART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(8), POR, PWM(6), RTC, TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

PIC24FJ1024GB606T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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