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PIC18LF27J13-I/SP

Microchip Technology

PIC18LF27J13-I/SP by Microchip Technology

The Microchip PIC18LF27J13-I/SP is an 8-bit microcontroller with a max clock frequency of 48 MHz, featuring 10 timers and 10-channel 12-bit ADC. It is ideal for industrial applications requiring low power consumption, offering 24 I/O lines and connectivity options like I2C and SPI interfaces.

Median Price

$5.340

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,258 parts In-Stock

1+ parts

$5.340

100+ parts

$4.430

1k+ parts

$4.080

10k+ parts

$3.890

1,258

$5.340

$4.430

$4.080

$3.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$4.640

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-

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86

$4.640

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NAC Semi

USA . 1,005 parts In-Stock

1+ parts

$5.540

100+ parts

$5.030

1k+ parts

$4.600

10k+ parts

-

1,005

$5.540

$5.030

$4.600

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Bristol Electronics

USA . 115 parts In-Stock

1+ parts

$6.980

100+ parts

$3.024

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-

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115

$6.980

$3.024

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Vyrian

USA . 4,402 parts In-Stock

1+ parts

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4,402

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Dan-Mar Components

USA . 115 parts In-Stock

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115

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Euro-Tech

UK . 41 parts In-Stock

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41

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Distributors (Availability)

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Ampacity Inc.

Singapore . 16 parts In-Stock

1+ parts

$4.540

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16

$4.540

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Netroflash

USA . 1,000 parts In-Stock

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$4.640

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$4.640

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Lixinc

USA . 17,932 parts In-Stock

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Fulton Briggs Corp.

USA . 6,288 parts In-Stock

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Overview

Unleash the power of innovation with the PIC18LF27J13-I/SP microcontroller by Microchip Technology. Designed with precision and reliability, this versatile device is perfect for a wide range of applications in the industrial sector. With advanced features like low power mode and high-speed connectivity options, this microcontroller offers unmatched performance and efficiency. Experience seamless integration and unparalleled functionality with the PIC18LF27J13-I/SP and unlock endless possibilities for your next project. Elevate your designs with this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient data processing and manipulation for the microcontroller.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy integration into existing designs or PCB layouts.

Bit Size: 8

The 8-bit architecture allows for simple and straightforward data handling, especially in applications requiring basic control functions.

Power Supplies (V): 2.5/3.3

The dual power supply options of 2.5V and 3.3V provide flexibility and compatibility with a wide range of power sources and peripherals.

No. of Terminals: 28

With 28 terminals, the microcontroller offers ample I/O options for connecting to external devices and sensors in complex systems.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and space utilization, making it suitable for applications with limited board real estate.

Minimum Supply Voltage: 2 V

The low minimum supply voltage of 2V allows for operation in power-constrained environments or battery-powered applications.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of -40°C to 85°C ensures reliable performance in harsh environmental conditions or industrial settings.

Technical Specifications

Microcontrollers PIC18LF27J13-I/SP attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.671 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

3760

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(3), CTMU, DMA(2), POR, PWM(3), RTCC, TIMER(10), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

PIC18LF27J13-I/SP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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