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PIC18LF26K83T-I/SS

Microchip Technology

PIC18LF26K83T-I/SS by Microchip Technology

PIC18LF26K83T-I/SS by Microchip: 64 MHz clock, 3.6V max supply, 1024 EEPROM size. Ideal for industrial applications requiring low power consumption and high-speed processing with CAN, I2C, SPI connectivity.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 449 parts In-Stock

1+ parts

$2.540

100+ parts

$2.110

1k+ parts

-

10k+ parts

$2.110

449

$2.540

$2.110

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$2.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,780 parts In-Stock

1+ parts

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4,780

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Nova Conductors

Japan . 39 parts In-Stock

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39

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Distributors (Availability)

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Semicontronic

India . 549 parts In-Stock

1+ parts

$2.160

100+ parts

$2.106

1k+ parts

$2.095

10k+ parts

-

549

$2.160

$2.106

$2.095

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Ampacity Inc.

Singapore . 520 parts In-Stock

1+ parts

$2.160

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520

$2.160

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Corohmni

South Africa . 419 parts In-Stock

1+ parts

$2.390

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419

$2.390

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RGB Technical Solutions

Ukraine . 7,056 parts In-Stock

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7,056

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the cutting-edge technology of the Microchip Technology PIC18LF26K83T-I/SS microcontroller, designed to bring unparalleled performance to a wide range of applications. With a focus on quality and innovation, Microchip Technology ensures that every product delivers exceptional value and reliability. From industrial automation to consumer electronics, this microcontroller is versatile and powerful, offering customers the advantage of seamless integration and maximum efficiency. Experience the future of microcontrollers with the PIC18LF26K83T-I/SS and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, offering flexibility in design and application.

Bit Size: 8

An 8-bit microcontroller offers a good balance between performance and cost, making it suitable for a variety of applications that do not require high processing power.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Words: 65536

With a ROM size of 65536 words, this microcontroller can store a significant amount of program code, enabling complex functionality and versatility.

Maximum Clock Frequency: 64 MHz

A high maximum clock frequency of 64 MHz provides fast processing speeds, enhancing the performance of the microcontroller in real-time applications.

Connectivity: CAN, I2C(2), SPI

Multiple connectivity options such as CAN, I2C, and SPI allow the microcontroller to communicate with a variety of external devices and systems, increasing its versatility.

Low Power Mode: YES

The inclusion of a low power mode helps reduce power consumption during idle or standby periods, making the microcontroller more energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microcontrollers PIC18LF26K83T-I/SS attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY FOR 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

3

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Speed:

64 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

CAN, I2C(2), SPI

Peripherals:

BOR, COMPARATOR(2), DMA(2), POR, TIMER(7), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC18LF26K83T-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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