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PIC18F66K22T-I/MRRSL

Microchip Technology

PIC18F66K22T-I/MRRSL by Microchip Technology

PIC18F66K22T-I/MRRSL by Microchip: 32-bit CPU, 64 MHz max clock freq, 16-Ch 12-Bit ADC. Ideal for industrial applications requiring high-speed processing, with connectivity options like I2C and SPI for versatile interfacing. Compact design with 64 terminals in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,763 parts In-Stock

1+ parts

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6,763

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$4.881

100+ parts

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730

$4.881

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Ampacity Inc.

Singapore . 177 parts In-Stock

1+ parts

$8.000

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177

$8.000

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Aztec Data Supply Inc.

USA . 265 parts In-Stock

1+ parts

$41.030

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265

$41.030

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Corohmni

South Africa . 342 parts In-Stock

1+ parts

$75.104

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342

$75.104

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Continental Prestige Electronics

USA . 6,938 parts In-Stock

1+ parts

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6,938

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Argo Parts USA

USA . 3,179 parts In-Stock

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3,179

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Fulton Briggs Corp.

USA . 2,554 parts In-Stock

1+ parts

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2,554

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Microchip USA

USA . 1,586 parts In-Stock

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1,586

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the PIC18F66K22T-I/MRRSL by Microchip Technology. As a leader in microcontrollers, Microchip Technology delivers unmatched quality and reliability. With a wide range of applications in various industries, this product offers exceptional value with its advanced features and capabilities. Experience the benefits of seamless connectivity, high-speed performance, and versatile peripherals that cater to all your project needs. Elevate your designs with the PIC18F66K22T-I/MRRSL and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this microcontroller durable and suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into electronic devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher power requirements.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

The square package shape makes this microcontroller compact and easy to mount on PCBs.

Bit Size: 32

The 32-bit architecture enables faster processing and enhanced performance.

Power Supplies (V): 2/5

With support for 2V and 5V power supplies, this microcontroller can be easily integrated into various systems.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for peripherals and external devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer flexibility and thermal management options for different application requirements.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions.

CPU Family: PIC18

Part of the PIC18 CPU family, this microcontroller offers advanced features and capabilities.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance in cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance.

ADC Channels: YES

The built-in ADC channels enable accurate analog to digital conversions, making this microcontroller suitable for sensor applications.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection in compact spaces.

ROM Words: 65536

With 65536 ROM words, this microcontroller provides ample storage for program and data storage.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for slim and compact designs.

Width: 9 mm

The 9mm width makes this microcontroller suitable for space-constrained applications.

Data EEPROM Size: 1K

The 1K data EEPROM size allows for easy and flexible data storage capabilities.

Peripherals: BOR, COMPARATOR(3), POR, PWM(10), RTC, TIMER(11), WDT

The various peripherals enhance the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 64 MHz

With a maximum clock frequency of 64MHz, this microcontroller offers high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40s ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for high-temperature soldering processes.

Length: 9 mm

The 9mm length makes this microcontroller compact and suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product offers extensive peripheral integration for diverse applications.

RAM Bytes: 4096

With 4096 RAM bytes, this microcontroller provides sufficient memory for data processing and storage.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces environmental impact.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit ADC converters enable precise analog signal conversion, making this microcontroller suitable for monitoring and control applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with common power sources.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, making this microcontroller suitable for motor control and power management applications.

Connectivity: I2C, LIN, SPI, SSP(2), USART(2)

With support for various communication protocols, this microcontroller enables seamless connectivity with other devices and systems.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and convenient updating of firmware and software.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and compact PCB designs.

Speed: 64 rpm

With a speed of 64rpm, this microcontroller offers fast processing capabilities for real-time applications.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width allows for efficient program storage and execution.

No. of I/O Lines: 53

With 53 I/O lines, this microcontroller offers extensive connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers PIC18F66K22T-I/MRRSL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 1.8 V MIN SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

32

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, LIN, SPI, SSP(2), USART(2)

Peripherals:

BOR, COMPARATOR(3), POR, PWM(10), RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

PIC18F66K22T-I/MRRSL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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