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PIC18F26Q10-E/ML

Microchip Technology

PIC18F26Q10-E/ML by Microchip Technology

The Microchip Technology PIC18F26Q10-E/ML is an 8-bit microcontroller with a max clock frequency of 64 MHz. It features 24-Ch 10-Bit ADC channels and 1-Ch 5-Bit DAC channels, making it suitable for automotive applications requiring precise analog-to-digital conversion. With low power mode and various peripherals like BOR, CLC, PWM, and more, this CMOS technology-based microcontroller offers versatile connectivity options through I2C, SPI, and EUSART interfaces.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$1.410

100+ parts

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700

$1.410

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Vyrian

USA . 5,584 parts In-Stock

1+ parts

-

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5,584

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,263 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

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10k+ parts

$1.382

1,263

$1.410

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$1.382

Argo Parts USA

USA . 1,146 parts In-Stock

1+ parts

$1.410

100+ parts

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1,146

$1.410

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.410

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1,000

$1.410

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AZTECH Wire

Italy . 441 parts In-Stock

1+ parts

$5.124

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441

$5.124

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Semicontronic

India . 851 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

851

$15.000

$14.625

$14.550

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Corohmni

South Africa . 679 parts In-Stock

1+ parts

$53.193

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679

$53.193

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Aztec Data Supply Inc.

USA . 241 parts In-Stock

1+ parts

$80.750

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241

$80.750

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RGB Technical Solutions

Ukraine . 7,941 parts In-Stock

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7,941

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Overview

Discover the innovative PIC18F26Q10-E/ML microcontroller by Microchip Technology, a game-changer in the world of electronics. With cutting-edge technology and top-notch quality, this product offers unmatched performance and reliability for a wide range of applications. From automotive to industrial uses, this microcontroller provides exceptional value, efficiency, and versatility, making it the ideal choice for all your electronic projects. Upgrade your designs today with the PIC18F26Q10-E/ML and experience the difference that Microchip Technology brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontroller packages as it provides good protection and insulation for the components inside.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of external components.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data and code, enabling complex applications to run smoothly.

Maximum Clock Frequency: 64 MHz

High clock frequency provides fast processing speed, making the microcontroller suitable for applications that require real-time responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture typically results in efficient performance and lower power consumption, making it well-suited for embedded systems.

RAM Bytes: 3615

A decent amount of RAM allows for efficient data processing and multitasking capabilities in the microcontroller.

Analog To Digital Convertors: 24-Ch 10-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals to digital data, making this microcontroller suitable for sensor-based applications.

Technical Specifications

Microcontrollers PIC18F26Q10-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of External Interrupts:

3

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

RAM Bytes:

3615

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

64 rpm

Maximum Supply Current:

5.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

I2C(2), SPI(2), EUSART(2)

Peripherals:

BOR, CLC(8), COMPARATOR(2), CRC, CWG, POR, PWM, TIMER(9), WWDT

Analog To Digital Convertors:

24-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC18F26Q10-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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