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PIC18F2320-E/SP

Microchip Technology

PIC18F2320-E/SP by Microchip Technology

PIC18F2320-E/SP by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 25 MHz. It features 512 bytes of RAM, 10-channel 10-bit ADC, and connectivity options such as I2C, SPI, and USART. This microcontroller is commonly used in automotive applications due to its temperature grade and package style.

Median Price

$7.450

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$7.450

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300

$7.450

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Vyrian

USA . 1,981 parts In-Stock

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1,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$3.000

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141

$3.000

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Continental Prestige Electronics

USA . 181 parts In-Stock

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$7.450

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$7.301

181

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$7.301

AZTECH Wire

Italy . 562 parts In-Stock

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$12.037

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562

$12.037

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Semicontronic

India . 1,056 parts In-Stock

1+ parts

$22.000

100+ parts

$21.450

1k+ parts

$21.340

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1,056

$22.000

$21.450

$21.340

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XL Components Corporation

Australia . 5,906 parts In-Stock

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5,906

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Argo Parts USA

USA . 3,628 parts In-Stock

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Microchip USA

USA . 2,924 parts In-Stock

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QualityLine Systems

Poland . 953 parts In-Stock

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953

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Marpe Global Electronics

Taiwan . 98 parts In-Stock

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Overview

Discover the PIC18F2320-E/SP, a top-of-the-line microcontroller by Microchip Technology. With its superior quality and reliability, Microchip Technology has established itself as a leading manufacturer in the industry. This microcontroller boasts a wide range of applications and offers customers unparalleled value, benefits, and advantages. From its powerful 8-bit processing capabilities to its versatile connectivity options, the PIC18F2320-E/SP is designed to meet all your needs. Experience optimal performance, exceptional power efficiency, and seamless integration with peripherals such as BOD, comparators, PWM, timers, and more. Upgrade your projects with the PIC18F2320-E/SP, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

No. of Terminals: 28

Offers ample connectivity options for interfacing with external devices and peripherals.

ADC Channels: YES

Enables analog-to-digital conversion, making the microcontroller suitable for sensor interfacing and data acquisition.

ROM Words: 4096

Provides sufficient memory space for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilization of Reduced Instruction Set Computing (RISC) architecture enhances the performance and efficiency of the microcontroller.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity.

Connectivity: I2C, SPI, USART

Support for popular communication interfaces enables seamless integration with other devices and systems.

Technical Specifications

Microcontrollers PIC18F2320-E/SP attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.67 mm

No. of I/O Lines:

25

No. of Terminals:

28

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

4.06 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(2), POR, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

PIC18F2320-E/SP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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