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PIC16LF721-I/SO

Microchip Technology

PIC16LF721-I/SO by Microchip Technology

PIC16LF721-I/SO by Microchip: 8-bit, 256B RAM, 4096 ROM words. Operates at -40 to 85°C. Ideal for industrial applications requiring low power consumption and connectivity with AUSART and SSP peripherals.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,248 parts In-Stock

1+ parts

$1.530

100+ parts

$1.270

1k+ parts

$1.180

10k+ parts

$1.100

7,248

$1.530

$1.270

$1.180

$1.100

DigiKey

USA . 532 parts In-Stock

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$1.530

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$1.270

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532

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$1.270

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Distributors (In-Stock)

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NAC Semi

USA . 5,814 parts In-Stock

1+ parts

$1.650

100+ parts

$1.490

1k+ parts

$1.340

10k+ parts

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5,814

$1.650

$1.490

$1.340

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Vyrian

USA . 7,067 parts In-Stock

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7,067

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,789 parts In-Stock

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$1.300

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3,789

$1.300

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RGB Technical Solutions

Ukraine . 7,381 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 40 parts In-Stock

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Overview

Elevate your projects with the PIC16LF721-I/SO microcontroller by Microchip Technology. Designed with top-notch quality and cutting-edge technology, this powerful device offers unmatched performance in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller provides exceptional value through its low power consumption, high-speed operation, and versatile connectivity options. Trust in Microchip Technology's industry-leading expertise and elevate your designs to new heights with the PIC16LF721-I/SO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable, making it suitable for a wide range of applications.

Bit Size: 8

The 8-bit architecture of the microcontroller allows for efficient processing of data and instructions, making it suitable for applications that require moderate computing power.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for fast and efficient operation of the microcontroller, making it suitable for time-critical applications.

RAM Bytes: 256

The microcontroller's generous 256 bytes of RAM provide ample space for data storage and manipulation, enabling it to handle complex algorithms and calculations effectively.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and inputs, making it versatile for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller, it offers efficient and simplified instructions for faster processing, making it a suitable choice for real-time applications.

Connectivity: AUSART, SSP

The inclusion of AUSART and SSP connectivity options enables the microcontroller to communicate with other devices and peripherals, enhancing its versatility and compatibility.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during idle or low-demand periods, making it energy-efficient and suitable for battery-powered applications.

Technical Specifications

Microcontrollers PIC16LF721-I/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

18

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

4

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

AUSART, SSP

Peripherals:

BOR, PWM, POR, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 8-Bit

Trade Compliance

PIC16LF721-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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