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PIC16LF18857T-I/ML

Microchip Technology

PIC16LF18857T-I/ML by Microchip Technology

The Microchip PIC16LF18857T-I/ML is an 8-bit microcontroller with a max clock frequency of 32 MHz. It features 4096 bytes of RAM, 256 bytes of data EEPROM, and 32768 ROM words. Ideal for industrial applications, it offers low power mode, connectivity options like EUSART and I2C, and peripherals such as BOR and PWM channels.

Median Price

$1.360

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$1.360

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700

$1.360

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Vyrian

USA . 2,898 parts In-Stock

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2,898

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.360

100+ parts

-

1k+ parts

$1.292

10k+ parts

$1.265

2,000

$1.360

-

$1.292

$1.265

Continental Prestige Electronics

USA . 1,582 parts In-Stock

1+ parts

$1.360

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$1.333

1,582

$1.360

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$1.333

Argo Parts USA

USA . 792 parts In-Stock

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$1.360

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792

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AZTECH Wire

Italy . 739 parts In-Stock

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$13.363

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739

$13.363

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Ampacity Inc.

Singapore . 203 parts In-Stock

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$17.000

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203

$17.000

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Corohmni

South Africa . 51 parts In-Stock

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$30.475

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51

$30.475

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Aztec Data Supply Inc.

USA . 1,956 parts In-Stock

1+ parts

$46.680

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$46.680

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Lixinc

USA . 1,855 parts In-Stock

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Eastek

USA . 1,000 parts In-Stock

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$2.470

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1,000

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$2.470

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RGB Technical Solutions

Ukraine . 827 parts In-Stock

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827

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Overview

Unleash the power of innovation with the PIC16LF18857T-I/ML microcontroller by Microchip Technology. This cutting-edge product offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With advanced features and a maximum clock frequency of 32 MHz, this microcontroller delivers exceptional performance while consuming minimal power. Experience seamless connectivity with EUSART, I2C, and SPI interfaces, allowing you to easily integrate this product into your designs. Say goodbye to limitations and hello to endless possibilities with the PIC16LF18857T-I/ML microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable for a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions.

ROM Words: 32768

The large ROM size of 32768 words allows for ample storage of program instructions for complex applications.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz enables fast processing speeds for real-time applications.

Analog To Digital Convertors: 24-Ch 10-Bit

The 24-channel 10-bit ADC provides high-resolution analog to digital conversion for accurate sensor data acquisition.

Connectivity: EUSART, I2C(2), SPI(2)

The various connectivity options including EUSART, I2C, and SPI enable seamless communication with other devices in a system.

Technical Specifications

Microcontrollers PIC16LF18857T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 1.8V MIN@16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of External Interrupts:

4

No. of I/O Lines:

25

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

4.25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

EUSART, I2C(2), SPI(2)

Peripherals:

BOR, COMPARATOR(2), CCP(5), CLC(4), CRC, FVR, POR, PWM(2), TIMER(9), WWDT, WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16LF18857T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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