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PIC16LF1829T-I/GZ

Microchip Technology

PIC16LF1829T-I/GZ by Microchip Technology

PIC16LF1829T-I/GZ by Microchip Technology is an 8-bit microcontroller with 8192 ROM words, 1024 RAM bytes, and 18 I/O lines. Operating at a max clock frequency of 32 MHz, it is suitable for industrial applications requiring a temperature range of -40 to 85°C. This chip carrier package features a square shape and matte tin terminal finish for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,072 parts In-Stock

1+ parts

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2,072

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,624 parts In-Stock

1+ parts

$10.920

100+ parts

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5,624

$10.920

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AZTECH Wire

Italy . 1,066 parts In-Stock

1+ parts

$12.170

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1,066

$12.170

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Ampacity Inc.

Singapore . 634 parts In-Stock

1+ parts

$20.000

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634

$20.000

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Corohmni

South Africa . 225 parts In-Stock

1+ parts

$39.085

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225

$39.085

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Fulton Briggs Corp.

USA . 1,722 parts In-Stock

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1,722

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of innovation with the PIC16LF1829T-I/GZ microcontroller by Microchip Technology. Designed to deliver top-notch performance and reliability, this versatile device is perfect for a wide range of applications. From IoT devices to automotive electronics, the possibilities are endless. With its cutting-edge technology and user-friendly features, the PIC16LF1829T-I/GZ offers exceptional value and convenience to customers looking to take their projects to the next level. Trust in Microchip Technology's reputation for excellence and let the PIC16LF1829T-I/GZ be the key to your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of this microcontroller lightweight and durable, contributing to its overall reliability.

Surface Mount: YES

The surface mount feature allows for easy installation and soldering onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can support a wide range of applications and power requirements.

Bit Size: 8

The 8-bit architecture of this microcontroller allows for efficient processing of data and instructions, suitable for various embedded systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with reduced instruction set computing, ideal for real-time processing tasks.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with a variety of sensors and input devices.

Maximum Clock Frequency: 32 MHz

With a maximum clock frequency of 32 MHz, this microcontroller can execute instructions at high speeds, enhancing overall system performance.

RAM Bytes: 1024

Having 1024 bytes of RAM provides ample memory for storing data and variables during program execution, facilitating smooth operation.

ROM Programmability: FLASH

The ROM programmability using FLASH technology allows for easy and quick reprogramming of the microcontroller, enabling flexibility in firmware updates.

No. of I/O Lines: 18

With 18 I/O lines, this microcontroller can interface with a variety of external devices and peripherals, expanding its functionality in embedded systems.

Technical Specifications

Microcontrollers PIC16LF1829T-I/GZ attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC

Maximum Clock Frequency:

32 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

No. of I/O Lines:

18

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PIC16LF1829T-I/GZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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