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PIC16LF1703-I/ML

Microchip Technology

PIC16LF1703-I/ML by Microchip Technology

PIC16LF1703-I/ML by Microchip is an 8-bit microcontroller with 2048 ROM words, 256 RAM bytes, and 128 data EEPROM size. It operates at a max clock frequency of 16 MHz and features peripherals like BOD, POR, PWM(2), TIMER(3), WDT for industrial applications. With ADC channels, I2C/SPI connectivity, and 12 I/O lines, it's suitable for various embedded systems requiring low power consumption.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

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$1.050

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49

$1.050

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Vyrian

USA . 5,148 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,466 parts In-Stock

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$1.050

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$1.029

6,466

$1.050

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$1.029

Argo Parts USA

USA . 3,188 parts In-Stock

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$1.050

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Ampacity Inc.

Singapore . 400 parts In-Stock

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$6.000

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400

$6.000

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Semicontronic

India . 283 parts In-Stock

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$11.000

100+ parts

$10.725

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$10.670

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283

$11.000

$10.725

$10.670

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AZTECH Wire

Italy . 565 parts In-Stock

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$11.924

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565

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LMD Electronica

Estonia . 8,061 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,671 parts In-Stock

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Microchip USA

USA . 3,997 parts In-Stock

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NIA Electronics

USA . 928 parts In-Stock

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Ledger Components

France . 928 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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Montano Global Distributors

Canada . 166 parts In-Stock

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Overview

Elevate your projects with the PIC16LF1703-I/ML microcontroller by Microchip Technology. With its cutting-edge technology and reliable performance, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile chip offers unparalleled value and benefits to customers. Trust in Microchip's reputation for quality and innovation, and unlock the full potential of your designs with the PIC16LF1703-I/ML.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy integration of the microcontroller onto a PCB, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape enables efficient use of PCB real estate and facilitates placement in tight spaces.

Bit Size: 8

The 8-bit architecture provides a good balance between performance and cost, suitable for a wide range of embedded applications.

No. of Terminals: 16

Having 16 terminals allows for a sufficient number of I/O options and connectivity possibilities.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage ensures energy efficiency and enables operation in low power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial environments with potential temperature fluctuations.

CPU Family: PIC16

Belonging to the PIC16 family of microcontrollers ensures compatibility with a well-established and widely used series of devices.

ADC Channels: YES

The presence of ADC channels allows for analog input capabilities, making the microcontroller suitable for sensor interfacing and data acquisition applications.

Technical Specifications

Microcontrollers PIC16LF1703-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 16MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

12

No. of Terminals:

16

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

I2C, SPI

Peripherals:

BOD, POR, PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

PIC16LF1703-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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